TI Unveils Power Solutions for Scalable AI Data Centres

Texas Instruments (TI) has introduced a new range of power management technologies and design resources to help engineers meet the increasing demands of artificial intelligence in modern data centres. Announced at the Open Compute Summit (OCP) in San Jose, these new solutions scale from 12V to 48V and up to 800V DC, providing higher efficiency, improved density, and greater system-level control for next-generation server infrastructure.

Advancing Power for AI Infrastructure

As artificial intelligence continues to reshape computing requirements, data centres are evolving from simple server rooms into highly complex energy systems. TI’s latest reference designs and power stages are engineered to help developers manage this transition by optimising power delivery, reducing conversion losses, and maintaining high reliability across a wide voltage range.

At the centre of the announcement is TI’s collaboration with NVIDIA, where both companies are developing power management devices to support 800V DC rack power. The work is outlined in the white paper “Power delivery trade-offs when preparing for the next wave of AI computing growth”, which examines how system-level efficiency and density can be improved as rack power approaches one megawatt in the coming years.

Key Innovations

One highlight from the release is a 30kW AI server power supply reference design that demonstrates high-efficiency dual-stage conversion using a three-phase, three-level flying capacitor PFC converter paired with dual delta-delta LLC converters. The system can operate as a single 800V output or as multiple isolated supplies depending on application requirements. TI has also unveiled several components aimed at boosting power density and thermal performance:

• CSD965203B Dual-Phase Smart Power Stage: Delivers 100A per phase in a compact 5mm by 5mm package, allowing engineers to increase phase count and power delivery without expanding PCB size.
• CSDM65295 Smart Power Module: Provides up to 180A of peak current while integrating two power stages and inductors with trans-inductor voltage regulation options, enabling efficient lateral power delivery in a small footprint.
• LMM104RM0 GaN Intermediate Bus Converter: Capable of delivering up to 1.6kW of output power in a quarter-brick form factor while achieving over 97.5 percent conversion efficiency, even under light load conditions.

Supporting Scalable Growth

“With the growth of AI, data centres are evolving from simple server rooms to highly sophisticated power infrastructure hubs,” said Chris Suchoski, Sector General Manager for Data Centres at TI. “Scalable power infrastructure and increased power efficiency are essential to meet these demands and drive future innovation.”

TI’s presence at the OCP Summit includes technical sessions focused on advanced AC/DC distribution and series-stacked power architectures, reinforcing its commitment to enabling efficient, secure, and sustainable AI data centre operations.

Learn more and read the original article on www.ti.com