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The latest electronics news, featuring updates and announcements from leading companies in the electronic components industry. Stay informed on product releases, industry trends, and market insights.
Japanese Scientists Develop Sensor That Generates Energy From Sweat
Recently, researchers from Japan have demonstrated a new energy generator that utilizes sweat. What challenges do wearable devices face, what did the researchers develop, and could it be the key to future flexible wearable devices?
Read MoreDiodes Shrinks High-Current MOSFETs For 48 V Vehicles
Diodes has introduced the 100 V DMTH10H1M7SPGWQ in its PowerDI8080-5 package, bringing 1.5 mΩ max RDS(ON) to 48 V automotive motor drives, battery disconnect switches, onboard chargers, and other compact high-current designs.
Read MorePower Integrations Pushes Flyback Into 440 W Range
Power Integrations has introduced TOPSwitchGaN flyback ICs that push offline flyback power supplies to 440 W, offering a simpler alternative to resonant and LLC designs in appliances, e-bike chargers, and industrial systems.
Read MoreMicrochip Shrinks The HMI Memory Problem In Vehicles
Microchip’s automotive-qualified SAM9X75D5M hybrid MCU combines an Arm926EJ-S processor and 512 Mbit DDR2 SDRAM in one package for cockpit displays, smart clusters, HVAC controls, and EV charger HMIs.
Read MoreAlibaba Reveals New CPU for AI Agents Using RISC-V
Alibaba has recently announced its latest AI accelerator, leveraging the RISC-V ISA for its open-source capabilities and ease of development. How has RISC-V risen in the industry, why is Alibaba using it, and could RISC-V dominate the future AI market?
Read MoreNew Radiation-Resistant Wi-Fi Chip Could Power Nuclear Robotics
Recently, researchers created a Wi-Fi solution capable of operating in extreme radiation environments. What challenges does radiation present, what did the researchers develop, and why is it so exciting?
Read MoreSemiQ Dual3 SiC Modules Push IGBT Drop-In Further
SemiQ’s 1200 V QSiC Dual3 half-bridge modules combine low RDSon SiC MOSFETs, optional Schottky diodes, and high power density to help replace IGBT modules in data center cooling, energy storage, and industrial power converters.
Read MoreToshiba Wettable-Flank MOSFETs Shift Package Priorities
Toshiba has launched five automotive MOSFETs in its DFN2020B(WF) package, combining wettable flanks, better AOI visibility, stronger solder-joint performance, and a smaller footprint for compact vehicle power designs.
Read MoreEPC GaN Inverter Board Targets Faster BLDC Prototyping
EPC’s EPC91121 gives engineers a compact three-phase GaN inverter platform for 24 V-class BLDC development, combining 50 ARMS output, integrated sensing, controller support, and switching up to 150 kHz.
Read MoreTI Pushes Isolated Power Density For EVs And Data Centers
TI’s UCC34141-Q1 and UCC33420 isolated power modules use IsoShield packaging to combine a planar transformer and isolated power stage, targeting compact automotive, industrial, and data center rails with up to 2 W output power.
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