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The latest electronics news, featuring updates and announcements from leading companies in the electronic components industry. Stay informed on product releases, industry trends, and market insights.
Planar Vacuum Tubes Could Replace Transistors
Vacuum tubes were phased out decades ago in favour of silicon transistors. But recently, researchers demonstrates planar vacuum devices which could very well replace transistors due to their superior performance. What challenges did tubes face, what did the researchers develop, and why could they potentiall replace transistors in the future?
Read MoreToshiba Adds Complementary Dual MOSFET For Motor Control And Load Switching
Toshiba has introduced the SSM6L826R, a 30 V complementary dual MOSFET that combines N-channel and P-channel devices in a TSOP6F package for motor control and load-switching applications in consumer and industrial equipment.
Read MoreComplementary Field-Effect Transistors – Approaching the 0.2nm Realm
As researchers continue to push the limits of what semiconductor technologies can do, it is clear that the next transistor technology to dominate will be the Complementary Field-Effect Transistor (CFET). What challenges do current transistors face, what are CFETs, and how will they empower the future?
Read MoreDiodes Targets Automotive PCIe 5.0 Links With New ReDriver
Diodes Incorporated has launched the PI3EQX32904Q, a four-channel 32Gbps automotive ReDriver for PCIe 5.0, SAS4, and CXL links in smart cockpit and ADAS compute platforms.
Read MoreYAGEO C0G VW80808 MLCCs Target Automotive Flex Stress
YAGEO Group has introduced C0G VW80808 automotive-grade flexible termination MLCCs with AEC-Q200 and VW80808 compliance, 1000 pF to 6.8 µF capacitance, and 6.3 V to 1000 V ratings.
Read MoreSamsung Breaks the 10nm DRAM Barrier
Recently, Samsung announced that it has broken the 10nm barrier currently facing DRAM, allowing them to pack more DRAM cells per unit area. What challenges does DRAM shrinking face, what did Samsung develop, and why is this innovation so critical now?
Read MoreLittelfuse TDB Series Brings DIP Switching to Tight SMT Layouts
Littelfuse and C&K’s TDB Series brings half-pitch SMT DIP switching to compact PCB designs, combining smaller footprints, sealed washable construction, and reliable low-power contact performance for industrial, power, security, and embedded systems.
Read MoreTorex XC9714 Keeps 36 V Buck Designs Flexible
Torex’s XC9714 Series is a 36 V, 2.0 A synchronous step-down DC/DC converter with built-in driver FETs, selectable PWM or PWM/PFM operation, and pin compatibility that helps reduce PCB redesign when power requirements change.
Read MoreTexas Instruments TinyEngine NPU Pushes AI Into MCU Designs
Texas Instruments introduces MSPM0G5187 and AM13Ex microcontrollers integrating the TinyEngine NPU, enabling low-latency edge AI inference in embedded systems including motor control, wearables and industrial devices.
Read MoreRenesas RH850/U2C MCU Targets Zoned Automotive Control
Renesas introduces the RH850/U2C automotive MCU built on 28nm technology with four cores, ASIL D functional safety, Ethernet TSN, CAN-XL connectivity and hardware cryptography for next-generation vehicle E/E architectures.
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