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Sensata FaultBreak Contactor Clears 16 kA EV Faults

Sensata introduces the FaultBreak contactor for electric vehicles, combining high voltage switching and resettable fault interruption with the ability to clear currents up to 16 kA.

Sensata, FaultBreak contactor, EV contactor, electric vehicle battery protection, high voltage contactor, EV safety systems, battery pack protection, EV power electronics, high voltage switching, automotive contactor, battery short circuit protection, EV architecture, electric vehicle safety, resettable fault protection, automotive power electronics

Torex XM981A Enables 48V to 12V Conversion Without Inductors

Torex XM981A is a 60V, 6A inductor-less charge pump module that converts 48V to 12V with up to 96.5% efficiency, enabling compact intermediate bus design and scalable current for industrial and communication systems.

Torex Semiconductor, XM981A, charge pump module, 48V power system, 12V intermediate bus, 60V converter, inductor-less DC converter, industrial power design, communication equipment power, intermediate bus architecture, LGA power module, high efficiency converter, 6A power module, parallel power scaling, compact power supply, 48V migration, low profile power module

STMicroelectronics’ Stellar P3E MCU Brings Real-Time AI Acceleration To Automotive Edge Intelligence

STMicroelectronics’ Stellar P3E automotive MCU integrates real time AI acceleration, PCM based memory and high performance Cortex R52 plus cores to support edge intelligence, virtual sensing and software defined vehicle architectures with microsecond level inference.

STMicroelectronics, Stellar P3E, automotive MCU, edge AI, neural accelerator, NPU, Cortex R52, software defined vehicle, EV systems, zonal architecture, PCM memory, xMemory, predictive maintenance, virtual sensors, embedded AI, real time control, automotive electronics

Applied Materials Advances GAA Transistor Engineering For Faster AI Chips At 2nm And Beyond

Applied Materials introduces new deposition, etch and radical treatment systems that improve GAA transistor nanosheets, reduce contact resistance and enhance trench precision for 2nm and angstrom class AI chips, boosting energy efficient compute performance.

Applied Materials, GAA transistors, nanosheets, 2nm process, angstrom era, transistor engineering, radical treatment, Viva system, Sym3 Z Magnum, Spectral ALD, molybdenum contacts, tungsten replacement, plasma etch control, AI chips, semiconductor manufacturing, device scaling, advanced logic nodes, materials engineering

Could X-Ray Lithography Be The Key To Future Semiconductors

As extreme ultraviolet lithography approaches its physical limits, the semiconductor industry looks beyond EUV toward X-ray lithography and alternative scaling strategies, exposing the growing challenges of sub-nanometer manufacturing.

EUV lithography, extreme ultraviolet, semiconductor manufacturing, chip fabrication, sub-nanometer nodes, X-ray lithography, ASML, Moore’s Law, transistor scaling, advanced packaging, chiplets, die stacking, optical interconnects, future of semiconductors

RECOM’s 240W DIN Rail Supply Enables High Power In Tight Spaces

RECOM’s RACPRO1-S240E DIN rail supply delivers 240W with convection cooling for compact industrial and automation systems.

RECOM, RACPRO1-S240E, DIN rail supply, AC DC converter, industrial power, power supply, compact power systems, thermal performance, convection cooling, surge capability, automation equipment, cabinet design, efficiency, IEC safety standards, industrial electronics, power density

RECOM’s 120 W DIN Rail Supply Shrinks Power Density Requirements

RECOM introduces a 120 W DIN rail PSU with 500 W per liter density, wide temperature operation and robust industrial load handling.

RECOM, RACPRO1 S120, DIN rail power supply, industrial PSU, 120 W supply, high power density, 500 W per liter, convection cooling, 24 V supply, 48 V supply, back feed tolerance, inrush limiting, EN 61000, IEC 61010, DC OK signal, panel design, automation, energy distribution, test and measurement

The AI Tax: Why Your Next Computer and Car Are Becoming Collateral Damage in the Silicon Supercycle

ASC Global outlines how AI demand is reshaping memory supply, raising costs, and pushing PCs, automotive, and industrial systems into tighter component constraints.

ASC Global, memory shortage, HBM, DDR5, DDR4, DRAM, automotive memory, enterprise SSDs, AI infrastructure, semiconductor supply chain, market analysis, wafer allocation, PC components, hyperscale data centers, component pricing trends, 2026 memory supercycle, supply constraints, manufacturing capacity shifts

Toshiba TB67S579FTG Brings Advanced Microstepping to Compact Motor Designs

Toshiba’s TB67S579FTG motor driver uses advanced microstepping and adaptive current control for smoother motion and lower system noise.

Toshiba, TB67S579FTG, stepper motor driver, microstepping, Advanced Microstep Technology, AGC2, AWGS, continuous microstepping, current control, bipolar stepper, office equipment, industrial systems, motion control ICs, torque stability, current waveform, VQFN48, embedded motion design, semiconductor

Microchip Extends PolarFire Video Platform for High Bandwidth Embedded Imaging

Microchip adds SDI IP cores and a quad CoaXPress bridge to its PolarFire FPGA video platform for high bandwidth embedded imaging.

Microchip, PolarFire, FPGA, SDI, CoaXPress, CXP, SLVS EC, embedded vision, video transport, medical imaging, industrial imaging, robotics, low power FPGA, SmartHLS, Libero, SMPTE, high bandwidth video, hardware security

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