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TE Connectivity MezzaWave Connectors Aim at Denser 56G Links

TE Connectivity has launched 56G MezzaWave connectors and cable assemblies for dense modular systems, supporting up to 56 Gbps PAM4 with open-pin-field architecture, routing flexibility, and standards-based interoperability.

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NXP and NVIDIA Target Real-Time Data Flow in Robots

NXP and NVIDIA introduce a robotics architecture using Holoscan Sensor Bridge to enable real-time data transport, sensor fusion, and synchronized motor control in humanoid and edge AI systems.

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Microchip’s Full-Stack Edge AI Platform Brings Real Intelligence To Low-Power MCUs And MPUs

Microchip’s full stack edge AI platform brings pre trained models, application code and unified tools to its MCUs, MPUs and FPGAs, enabling secure, efficient and production ready intelligence directly at the edge for industrial, automotive and IoT systems.

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Cadence Launches HiFi iQ DSP for Next Generation Voice AI and Audio Processing

Cadence’s HiFi iQ DSP brings higher AI and audio performance for next generation voice and immersive sound applications.

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STMicroelectronics Targets Always-On Vision With Low-Power Image Sensors

STMicroelectronics VD55G4 and VD65G4 bring ultralow power global shutter sensing to always-on vision systems in wearables, IoT, and embedded designs.

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Kontron mITX Board With Ryzen AI Embedded P100 Targets Real-Time Edge AI

Kontron’s K4131 Px mITX motherboard uses the AMD Ryzen AI Embedded P100 to combine multi display graphics, local AI inference, legacy connectivity and wide input power handling for industrial edge automation, vision and HMI systems.

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Advantech i.MX 95 Modules Push Real-Time Edge AI Toward More Deterministic Control

Advantech’s i.MX 95 based modules combine multi domain compute, 2 TOPS AI acceleration, multi sensor imaging and TSN networking to support real time industrial automation, machine vision and advanced HMI systems at the edge.

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Qualcomm Snapdragon Wear Elite Brings On-Device AI Compute to Power-Constrained Wearables

The Qualcomm Snapdragon Wear Elite platform introduces an NPU for on-device AI, multi-mode connectivity, and power-efficient compute islands to support next-generation wearables that run complex models while maintaining multi-day battery life.

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congatec Extends Core Ultra COMs for Rugged Edge AI

congatec has expanded its Intel Core Ultra Series 3 COM family with rugged -40 °C to +85 °C variants for embedded edge AI and industrial systems.

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STMicroelectronics’ Stellar P3E MCU Brings Real-Time AI Acceleration To Automotive Edge Intelligence

STMicroelectronics’ Stellar P3E automotive MCU integrates real time AI acceleration, PCM based memory and high performance Cortex R52 plus cores to support edge intelligence, virtual sensing and software defined vehicle architectures with microsecond level inference.

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