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ABLIC S-57W1/W2 Dual Hall ICs Simplify Motor Feedback in Space-Constrained Designs

ABLIC’s S-57W1/W2 integrates two Hall elements in one IC, giving engineers high-resolution speed and direction feedback without using two sensors.

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Deca and SST Partner to Advance NVM Chiplet Architectures

Deca and SST join forces to deliver modular NVM chiplets, combining Adaptive Patterning and SuperFlash technologies for advanced multi-die systems.

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Nexperia Brings MLPAK MOSFETs to Automotive Designs

Nexperia’s new MLPAK33-WF and MLPAK56-WF MOSFETs save board space while maintaining thermal and electrical performance for automotive power designs.

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ROHM Ultra-Compact Op Amp Cuts Current to 160 nA

ROHM’s TLR1901GXZ CMOS op amp delivers just 160 nA typical current in a sub-1 mm² package, extending battery life in IoT and sensing applications.

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Qualcomm and Valeo Extend ADAS Partnership for Software-Defined Vehicles

Qualcomm and Valeo expand their ADAS partnership with a pre-integrated platform combining Snapdragon Ride SoCs and Valeo sensors for software-defined vehicles.

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Murata Expands Isolated DC-DC Converters for PoE Devices

Murata introduces compact isolated DC-DC converters for IEEE 802.3af PoE systems, delivering efficient 5 V power in space-constrained devices such as cameras and biometric units.

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EPC Highlights GaN Power Advances at PCIM Asia 2025

EPC will showcase GaN solutions for AI servers, robotics, and UAVs at PCIM Asia 2025, as momentum grows for GaN to replace silicon in high-frequency power.

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Nordic Adds Bare Metal Option to nRF Connect SDK for Simpler Bluetooth LE Development

Nordic introduces Bare Metal development in the nRF Connect SDK, easing migration to nRF54L SoCs with a lightweight alternative to Zephyr RTOS.

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Diodes AL5958Q LED Driver Targets Dynamic Automotive Lighting Challenges

The AL5958Q from Diodes reduces blur, ghosting, and EMI in LED matrices, giving engineers precise control for advanced displays and automotive lighting.

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Panasonic Industry Brings Bluetooth 6.0 to Mass Production with PAN B611-1 Module

Panasonic Industry’s PAN B611-1 Bluetooth 6.0 module supports Channel Sounding, multi-protocol operation, and compact design for IoT and Matter applications.

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