Latest News
The latest electronics news, featuring updates and announcements from leading companies in the electronic components industry. Stay informed on product releases, industry trends, and market insights.
Panasonic Introduces HE-S SC Relays for Single-Phase EV Chargers
Panasonic Industry has introduced the HE-S SC relay family for single-phase EV charging systems, offering 40A switching, IEC 62955 short-circuit compliance, 400mW coil holding power, and optional mirror-contact monitoring.
Read MoreWürth Elektronik Adds Nanocrystalline Cable Cores for EMI Suppression
Würth Elektronik has introduced the WE-NCC series of nanocrystalline cable cores for EMI suppression, offering permeability from 30,000 to 90,000, cable diameters up to 21.1 mm, and higher low-frequency impedance than conventional ferrite cores.
Read MoreSamsung First to Build 3D Stacked Transistors
Finally, it looks like that we may be entering the next era of semiconductor design, utilizing stacked transistor designs. Samsung has just announced that it is the first to achieve a 3D stacked design that could instantly double the number of devices on a die, and if their claims are true, could be a game-changer for the industry and technology as a whole.
Read MoreISS Air Leak and How Sensors Solve This
Recently, astronauts on the ISS had to shelter from an air leak that threatened to depressurize the entire space station, but thanks to sensitive sensors and modern technology, the leak was found and patched. What exactly happened, how are air leaks detected, and how does this demonstrate the brilliance of modern sensing technologies?
Read MoreHuawei Unveils Plans for 1.4nm Devices
As the US continues to try and limit China’s technological capabilities, Huawei has recently revealed their plans to achieve 1.4nm chips, something that would negate all US efforts. What challenges does China face in creating smaller transistors, what did Huawei announce, and why could this be the end of US capabilities in limiting Chinese engineers?
Read MoreSK hynix Targets HBM Thermal Bottlenecks With Integrated Cooling Structure
SK hynix has introduced its iHBM thermal solution for next-generation HBM memory, embedding integrated cooling elements directly into the package to reduce thermal resistance by 30 percent in AI accelerator systems.
Read MoreChinese Manufacturer Firefly releases RISC-V Rack Servers with 128 RISC-V Modules
As RISC-V continues to become a more viable platform, Chinese manufacturer Firefly has recently released a new server rack, packed with 128 RISC-V modules and as many as 1024 CPU cores. How has RISC-V risen over the past few years, what has Firefly launched, and why does this signal a new era in server computing?
Read MoreCould Russia Jump Over EUV and Straight Into X-Ray Lithography?
With recent reports revealing that Russia may be looking to skip EUV and go straight into X-Ray lithography, many are wondering if they will achieve it, and if so, what that means for the rest of the world. What challenges do countries like Russia currently face, what has been revealed, and could we be entering the next phase of semiconductor manufacturing?
Read MoreResearchers Create New Memory Chip that Reduces Size and Power
Recently, researchers have developed a new memory chip that supposed breaks the rules of miniaturization, helping to solve the issues faced with overheating. What challenges does reducing memory technologies introduce, what did the researchers develop, and how could it help with the future of electronics?
Read MoreMicrochip CLB PIC MCUs Fold Logic Into 8-Bit Control
Microchip’s PIC16F13276 and PIC18-Q35 families combine MCU control with integrated programmable logic, targeting lower latency, deterministic timing, reduced BOM count, and simpler design in motor control, industrial, and automotive systems.
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