Latest News
The latest electronics news, featuring updates and announcements from leading companies in the electronic components industry. Stay informed on product releases, industry trends, and market insights.
MCC Targets Compact High-Current Designs with a 40 V MOSFET
MCC MCAC2D9N04YHQ delivers low Rds(on) and efficient thermal performance for space-constrained high-current power stages.
Read MoreRenesas R-Car X5H Targets Multi-Domain SDV Compute at 3nm
Renesas R-Car X5H brings 3 nm multi-domain compute, AI acceleration and SDV-ready software support for next-generation vehicles.
Read MoreMurata ULTICIRC Substrate Targets Low Loss 6G RF Designs
Murata’s ULTICIRC LCP substrate uses an Inner Cavity design to achieve Dk below 2.0 and lower transmission loss for FR3 and 6G RF hardware.
Read MoreRenesas RA6W1 and RA6W2 Bring Wi Fi 6 to Ultra Low Power IoT
Dual band Wi Fi 6 MCUs offer ultra low power connectivity for always on IoT systems.
Read MoreiDEAL SuperQ MOSFET Raises Safety Margin For High Voltage Batteries
iDEAL’s SuperQ MOSFET boosts short circuit robustness and reduces parallel device count in high voltage battery systems.
Read MoreMicrochip’s Radiation-Tolerant CAN FD Transceiver Aims at the Next Generation of Spacecraft
Microchip’s ATA6571RT CAN FD transceiver supports 5 Mbps data rates and resists radiation exposure, providing reliable communication for satellites and spacecraft.
Read MoreLittelfuse Simplifies Smart HVAC and Building Control with Load-Powered Latching Relay
Littelfuse’s CPC1601M is a compact solid-state latching relay that powers itself from the load, reducing wiring and power needs in building-automation and HVAC systems.
Read MoreWürth Elektronik Expands MagI³C-VDMM Series for Smarter Point-of-Load Design
Würth Elektronik adds 1 A, 2 A, and 3 A MagI³C-VDMM MicroModules combining full DC-DC regulation, EMI compliance, and high efficiency in a 3.5 mm package
Read MoreRenesas RA8T2 MCU Delivers 1 GHz Motor Control and Built-In Networking
Renesas launches RA8T2 MCUs with 1 GHz Cortex-M85, dual-core option, MRAM, and EtherCAT support for precision motor control and factory networking.
Read MoreROHM Launches DOT-247 SiC Module with 2.3× Power Density
ROHM’s new DOT-247 SiC module delivers 2.3× power density, 15% lower thermal resistance, and supports advanced multi-level power topologies.
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