Latest News
The latest electronics news, featuring updates and announcements from leading companies in the electronic components industry. Stay informed on product releases, industry trends, and market insights.
Digi Launches Medical-Grade Serial Server for Patient Care
Digi’s Connect EZ 4 WS bridges medical serial equipment to modern networks with IEC 60601-1 compliance, encryption, Wi-Fi, and remote management.
Read MoreToshiba 650V SiC MOSFETs Boost Efficiency With Compact TOLL Package
Toshiba has launched 3rd generation 650V SiC MOSFETs in a compact TOLL package, cutting switching losses and improving power density for industrial and energy systems.
Read MoreSCHURTER ALO Fuse Series Supports 800 V EV Platforms
SCHURTER’s ALO fuses deliver up to 1000 VDC and 900 A protection, meeting global EV standards and supporting next-gen 800 V architectures.
Read MoreKeysight HDMI 2.2 Test Solution Targets 8K and Beyond
Keysight’s HDMI compliance test platform helps engineers meet HDMI 2.2 standards and optimise performance for 8K and HDR applications.
Read MoreRenesas Brings New 16-bit RL78/L23 MCUs to Smart Appliances and IoT
Renesas expands the RL78 family with the L23 MCUs, adding ultra-low power, LCD control, capacitive touch, and FOTA updates for smart appliances and IoT.
Read MoreAmbiq Introduces Apollo510B: Wireless SoC for Energy-Efficient Edge AI
Ambiq’s Apollo510B combines Cortex-M55 AI acceleration, BLE 5.4, and low-power graphics to enable always-on edge devices such as wearables and health monitors.
Read MoreBravechip Chiplet Brings Nordic’s nRF54L15 to Next-Gen Smart Rings
Bravechip integrates Nordic’s nRF54L15 SoC into its smart ring chiplet, enabling advanced health monitoring, gesture control, and longer battery life.
Read MoreToshiba TCD2728DG CCD Sensor Cuts Noise for High-Speed A3 Scanning
Toshiba’s TCD2728DG CCD sensor reduces noise by 40%, speeds up A3 scanning, and simplifies integration for printers and inspection systems.
Read MoreApplied Materials, Apple, and TI Rewire the US Chip Supply Chain
Applied Materials supports Apple and TI with US-made chip equipment and a $200M Arizona investment to boost semiconductor manufacturing and supply chain resilience.
Read MoreToshiba’s New MOSFETs Use Advanced Packaging to Cut Losses and Boost Efficiency
Toshiba launches new MOSFETs in SOP Advance(E) package, reducing RDS(on) and thermal resistance for efficient SMPS performance.
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