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Digi Launches Medical-Grade Serial Server for Patient Care

Digi’s Connect EZ 4 WS bridges medical serial equipment to modern networks with IEC 60601-1 compliance, encryption, Wi-Fi, and remote management.

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Toshiba 650V SiC MOSFETs Boost Efficiency With Compact TOLL Package

Toshiba has launched 3rd generation 650V SiC MOSFETs in a compact TOLL package, cutting switching losses and improving power density for industrial and energy systems.

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SCHURTER ALO Fuse Series Supports 800 V EV Platforms

SCHURTER’s ALO fuses deliver up to 1000 VDC and 900 A protection, meeting global EV standards and supporting next-gen 800 V architectures.

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Keysight HDMI 2.2 Test Solution Targets 8K and Beyond

Keysight’s HDMI compliance test platform helps engineers meet HDMI 2.2 standards and optimise performance for 8K and HDR applications.

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Renesas Brings New 16-bit RL78/L23 MCUs to Smart Appliances and IoT

Renesas expands the RL78 family with the L23 MCUs, adding ultra-low power, LCD control, capacitive touch, and FOTA updates for smart appliances and IoT.

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Ambiq Introduces Apollo510B: Wireless SoC for Energy-Efficient Edge AI

Ambiq’s Apollo510B combines Cortex-M55 AI acceleration, BLE 5.4, and low-power graphics to enable always-on edge devices such as wearables and health monitors.

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Bravechip Chiplet Brings Nordic’s nRF54L15 to Next-Gen Smart Rings

Bravechip integrates Nordic’s nRF54L15 SoC into its smart ring chiplet, enabling advanced health monitoring, gesture control, and longer battery life.

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Toshiba TCD2728DG CCD Sensor Cuts Noise for High-Speed A3 Scanning

Toshiba’s TCD2728DG CCD sensor reduces noise by 40%, speeds up A3 scanning, and simplifies integration for printers and inspection systems.

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Applied Materials, Apple, and TI Rewire the US Chip Supply Chain

Applied Materials supports Apple and TI with US-made chip equipment and a $200M Arizona investment to boost semiconductor manufacturing and supply chain resilience.

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Toshiba’s New MOSFETs Use Advanced Packaging to Cut Losses and Boost Efficiency

Toshiba launches new MOSFETs in SOP Advance(E) package, reducing RDS(on) and thermal resistance for efficient SMPS performance.

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