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Filtering by tag: "signal integrity"
Clear tag filterDiodes PI2MEQX2505Q Improves MIPI D-PHY Signal Integrity In High Resolution Automotive Cameras
Diodes PI2MEQX2505Q restores MIPI D PHY signaling for high resolution automotive camera and ADAS systems with configurable equalization and low power modes.
Read MoreDiodes Introduces Tiny eUSB2-to-USB 2.0 Repeaters for Compact Embedded Systems
Diodes Incorporated releases compact eUSB2-to-USB 2.0 repeaters for signal reliability in space-constrained embedded electronics and consumer devices.
Read MoreDiodes PI2DPT1021Q Boosts Signal Integrity for Automotive USB and DisplayPort Systems
Diodes Incorporated releases the PI2DPT1021Q, a 10 Gbps retimer that restores USB 3.2 and DisplayPort 1.4 signals for automotive and industrial platforms.
Read MoreToshiba expands digital isolators for stable industrial control
Toshiba adds new dual channel digital isolators with high CMTI and low delay to improve signal reliability in noisy industrial environments.
Read MoreTDK Brings High-Inductance Thin-Film Parts to Optical Transceivers in AI Data Centers
TDK’s new 10 µH thin-film inductor delivers low resistance and high reliability for optical transceivers in AI data centres.
Read MoreMolex Impress Moves 224G Links Onto the ASIC Substrate
Molex launches Impress Co-Packaged Copper, a compression-attached substrate connector delivering 224G PAM-4 near-ASIC connectivity to reduce PCB loss and support next-generation AI and hyperscale data center architectures.
Read MoreSamtec’s 0.80 mm Edge-Card Sockets Target High-Speed Modular Designs
Samtec’s HSEC8 0.80 mm edge-card sockets use machined contacts to support high-speed, high-cycle modular systems.
Read MoreDiodes Rolls Out Compact HDMI 2.1 ReDrivers with 8K and DDC Listener
Diodes launches the PI3HDX12311 and PI3HDX6311 HDMI ReDrivers for 8K video, with DDC Listener, trace cancellation, and compact footprint.
Read MoreNexperia Launches Industry-First ESD Diodes for 48 V EV Communication Networks
Nexperia releases the first ESD diodes for 48 V EV data lines, delivering low capacitance and robust automotive-grade protection.
Read MoreBourns RF Inductors Push High Frequency Stability Into Smaller Footprints
Bourns has introduced new multilayer chip inductors in compact case sizes with high SRF performance for RF amplifiers, wireless modules, radar, and communication systems, offering stable high frequency behavior with monolithic construction.
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