Latest News
The latest electronics news, featuring updates and announcements from leading companies in the electronic components industry. Stay informed on product releases, industry trends, and market insights.
Malaysia Looks Towards Self-Made 3nm Chips
As Malaysia looks towards creating its own 3nm chips, the future of semiconductors in the country looks positive. But while its collaboration with ARM is certainly interesting, it’s also unusual for its choice of ARM over RISC-V. What challenges do countries like Malaysia face, what exactly is it doing with ARM, and why could RISC-V have been a better choice?
Read MoreCould Russia Jump Over EUV and Straight Into X-Ray Lithography?
With recent reports revealing that Russia may be looking to skip EUV and go straight into X-Ray lithography, many are wondering if they will achieve it, and if so, what that means for the rest of the world. What challenges do countries like Russia currently face, what has been revealed, and could we be entering the next phase of semiconductor manufacturing?
Read MoreDiodes Introduces PCIe 7.0 Clock Generator For 128GT/s Links
Diodes Incorporated has introduced the PI6CG33A06 PCIe 7.0 clock generator with sub-30fs RMS jitter, six differential outputs, and LP-HCSL outputs for servers, HPC systems, and AI infrastructure.
Read MoreDiodes Targets Automotive PCIe 5.0 Links With New ReDriver
Diodes Incorporated has launched the PI3EQX32904Q, a four-channel 32Gbps automotive ReDriver for PCIe 5.0, SAS4, and CXL links in smart cockpit and ADAS compute platforms.
Read MoreWürth Elektronik Launches WE-SFIA Flat-Wire Inductors
Würth Elektronik has launched the WE-SFIA SMT flat-wire inductor series for automotive DC/DC converters and filter chokes, with up to 158 A saturation current, 1.0 mΩ typical DCR, and operation from -40°C to +180°C.
Read MoreMicron Starts Shipping 245TB 6600 ION Data Center SSD
Micron has started shipping its 245TB 6600 ION data center SSD, targeting AI infrastructure, hyperscale storage, and cloud deployments where rack density, cooling efficiency, and power constraints are becoming major operational challenges.
Read MoreSamtec Adds Through-Hole Options to mPOWER Connectors
Samtec has expanded its ultra micro mPOWER connector family with through-hole PCB termination options for industrial, aerospace, and military systems requiring compact high-current interconnects with improved mechanical robustness and vibration resistance.
Read MoreApple Now Considering Intel and Samsung For Future Devices over TSMC
In a move that some did not expect, Apple is floating the idea of looking at Samsung and Intel as its providers for custom chips over TSMC, now that TSMC supply is being taken over by AI industries. What challenges is the rise of AI introducing for those needing custom chips, what has Apple said, and what does this show us regarding the ongoing chip supply issues?
Read MoreResearchers Create New Memory Chip that Reduces Size and Power
Recently, researchers have developed a new memory chip that supposed breaks the rules of miniaturization, helping to solve the issues faced with overheating. What challenges does reducing memory technologies introduce, what did the researchers develop, and how could it help with the future of electronics?
Read MoreSiTime Elite 2 Targets Timing In AI GPU Clusters
SiTime’s Elite 2 Super-TCXO brings 1ns timing accuracy to AI data center synchronization, with MEMS stability, ±2ppb/°C frequency slope, 6 × 10⁻¹² ADEV, and compact package options.
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