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TI Pushes Isolated Power Density For EVs And Data Centers

TI’s UCC34141-Q1 and UCC33420 isolated power modules use IsoShield packaging to combine a planar transformer and isolated power stage, targeting compact automotive, industrial, and data center rails with up to 2 W output power.

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Alpha and Omega Semiconductor MOSFETs Target AI Server Power Density

Alpha and Omega Semiconductor has introduced the AONC40202 and AONC68816 MOSFETs in DFN 3.3 x 3.3 double-sided cooling source-down packages for AI server Intermediate Bus Converter applications.

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Littelfuse 200 V X4-Class MOSFET Targets High-Current Power Systems

The Littelfuse MMIX1T500N20X4 delivers 200 V and 480 A performance with topside cooling for compact high current power systems.

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RECOM AC/DC Module Pushes 65 W Into Less Space

RECOM’s RACM65S-K/277 is a compact 65 W AC/DC power module with 85 VAC to 305 VAC input, over 90% peak efficiency, multiple fixed outputs, and approvals for industrial, medical, and household applications.

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STMicroelectronics Pushes 800 VDC Power Closer to AI GPUs

STMicroelectronics expands its 800 VDC power architecture with new 12V and 6V conversion stages, enabling more efficient power delivery closer to GPUs in high-density AI data center infrastructure.

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TDK Expands i7A Series With 1000 W DC-DC Buck Converters in a 1/16th Brick

TDK’s latest i7A DC-DC buck converters deliver up to 1000 W and 80 A in a compact 1/16th brick footprint, offering wide input ranges and efficiencies up to 99 percent.

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onsemi Introduces Vertical GaN Semiconductors for High-Density Power Systems

onsemi introduces vertical GaN-on-GaN power semiconductors with 700 V and 1,200 V capability, cutting switching losses and boosting power density for AI and EV systems.

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SemiQ Dual3 SiC Modules Push IGBT Drop-In Further

SemiQ’s 1200 V QSiC Dual3 half-bridge modules combine low RDSon SiC MOSFETs, optional Schottky diodes, and high power density to help replace IGBT modules in data center cooling, energy storage, and industrial power converters.

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Infineon TLVR Power Module Pushes Current Density Past 2 A/mm²

Infineon’s TDM24745T quad-phase TLVR power module delivers over 2 A/mm² current density and up to 320 A peak current for AI accelerators, GPUs, and dense server power architectures where transient response and board space are under pressure.

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Alpha and Omega’s 600V αMOS E2 Device Targets High Stress Power Designs

AOS introduces the αMOS E2 600V MOSFET with robust diode behavior and strong switching performance for high density power and solar systems.

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TI Pushes Isolated Power Density For EVs And Data Centers

Alpha and Omega Semiconductor MOSFETs Target AI Server Power Density

Littelfuse 200 V X4-Class MOSFET Targets High-Current Power Systems

RECOM AC/DC Module Pushes 65 W Into Less Space

STMicroelectronics Pushes 800 VDC Power Closer to AI GPUs

TDK Expands i7A Series With 1000 W DC-DC Buck Converters in a 1/16th Brick

onsemi Introduces Vertical GaN Semiconductors for High-Density Power Systems

SemiQ Dual3 SiC Modules Push IGBT Drop-In Further

Infineon TLVR Power Module Pushes Current Density Past 2 A/mm²

Alpha and Omega’s 600V αMOS E2 Device Targets High Stress Power Designs

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