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Infineon TLVR Power Module Pushes Current Density Past 2 A/mm²

Infineon’s TDM24745T quad-phase TLVR power module delivers over 2 A/mm² current density and up to 320 A peak current for AI accelerators, GPUs, and dense server power architectures where transient response and board space are under pressure.

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SemiQ Dual3 SiC Modules Push IGBT Drop-In Further

SemiQ’s 1200 V QSiC Dual3 half-bridge modules combine low RDSon SiC MOSFETs, optional Schottky diodes, and high power density to help replace IGBT modules in data center cooling, energy storage, and industrial power converters.

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TI Pushes Isolated Power Density For EVs And Data Centers

TI’s UCC34141-Q1 and UCC33420 isolated power modules use IsoShield packaging to combine a planar transformer and isolated power stage, targeting compact automotive, industrial, and data center rails with up to 2 W output power.

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RECOM AC/DC Module Pushes 65 W Into Less Space

RECOM’s RACM65S-K/277 is a compact 65 W AC/DC power module with 85 VAC to 305 VAC input, over 90% peak efficiency, multiple fixed outputs, and approvals for industrial, medical, and household applications.

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Alpha and Omega Semiconductor MOSFETs Target AI Server Power Density

Alpha and Omega Semiconductor has introduced the AONC40202 and AONC68816 MOSFETs in DFN 3.3 x 3.3 double-sided cooling source-down packages for AI server Intermediate Bus Converter applications.

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STMicroelectronics Pushes 800 VDC Power Closer to AI GPUs

STMicroelectronics expands its 800 VDC power architecture with new 12V and 6V conversion stages, enabling more efficient power delivery closer to GPUs in high-density AI data center infrastructure.

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Navitas’ 10 kW GaN Converter Pushes HVDC Data Centers Toward Higher Power Density

Navitas’ 10 kW GaN based DC DC converter delivers 98.5 percent peak efficiency and high power density for 800 V DC and plus minus 400 V DC data centers, supporting fast switching and dynamic AI workloads.

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TDK’s μPOL FS1525 Pushes Vertical Power Delivery Toward 200 A Density

TDK’s FS1525 μPOL module delivers 25 A per unit and scales to 200 A for vertical power delivery, integrating magnetics, MOSFETs and control in a compact package for AI, FPGA and data center platforms.

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RECOM’s 240W DIN Rail Supply Enables High Power In Tight Spaces

RECOM’s RACPRO1-S240E DIN rail supply delivers 240W with convection cooling for compact industrial and automation systems.

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Alpha and Omega’s 600V αMOS E2 Device Targets High Stress Power Designs

AOS introduces the αMOS E2 600V MOSFET with robust diode behavior and strong switching performance for high density power and solar systems.

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Infineon TLVR Power Module Pushes Current Density Past 2 A/mm²

SemiQ Dual3 SiC Modules Push IGBT Drop-In Further

TI Pushes Isolated Power Density For EVs And Data Centers

RECOM AC/DC Module Pushes 65 W Into Less Space

Alpha and Omega Semiconductor MOSFETs Target AI Server Power Density

STMicroelectronics Pushes 800 VDC Power Closer to AI GPUs

Navitas’ 10 kW GaN Converter Pushes HVDC Data Centers Toward Higher Power Density

TDK’s μPOL FS1525 Pushes Vertical Power Delivery Toward 200 A Density

RECOM’s 240W DIN Rail Supply Enables High Power In Tight Spaces

Alpha and Omega’s 600V αMOS E2 Device Targets High Stress Power Designs

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