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Molex Impress Moves 224G Links Onto the ASIC Substrate

Molex launches Impress Co-Packaged Copper, a compression-attached substrate connector delivering 224G PAM-4 near-ASIC connectivity to reduce PCB loss and support next-generation AI and hyperscale data center architectures.

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TE Connectivity MezzaWave Connectors Aim at Denser 56G Links

TE Connectivity has launched 56G MezzaWave connectors and cable assemblies for dense modular systems, supporting up to 56 Gbps PAM4 with open-pin-field architecture, routing flexibility, and standards-based interoperability.

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Samtec AcceleRate Slim Cables Add More Flexible Signal Routing

Samtec’s AcceleRate Slim ARC6 cable assemblies now include single-ended and mixed-signaling options, extending their use in dense computing, FPGA prototyping, emulation, and MIPI systems while retaining the narrow body and direct-attach cable architecture.

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Samtec’s 0.80 mm Edge-Card Sockets Target High-Speed Modular Designs

Samtec’s HSEC8 0.80 mm edge-card sockets use machined contacts to support high-speed, high-cycle modular systems.

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Keysight HDMI 2.2 Test Solution Targets 8K and Beyond

Keysight’s HDMI compliance test platform helps engineers meet HDMI 2.2 standards and optimise performance for 8K and HDR applications.

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Toshiba expands digital isolators for stable industrial control

Toshiba adds new dual channel digital isolators with high CMTI and low delay to improve signal reliability in noisy industrial environments.

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Diodes Introduces Tiny eUSB2-to-USB 2.0 Repeaters for Compact Embedded Systems

Diodes Incorporated releases compact eUSB2-to-USB 2.0 repeaters for signal reliability in space-constrained embedded electronics and consumer devices.

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Diodes PI2MEQX2505Q Improves MIPI D-PHY Signal Integrity In High Resolution Automotive Cameras

Diodes PI2MEQX2505Q restores MIPI D PHY signaling for high resolution automotive camera and ADAS systems with configurable equalization and low power modes.

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TE Connectivity Launches Ultra Low-Profile PCIe Gen 7 Connectors for AI and Data Centers

TE Connectivity’s Ultra Low-Profile PCIe Gen 7 connectors deliver 128 GT/s performance in an 8.7 mm height, enabling compact, high-speed AI and data center designs.

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Keysight XR8 Scope Architecture Pushes High Speed Validation Forward

Keysight’s Infiniium XR8 oscilloscope introduces a new front end with integrated ADC and DSP processing, reducing noise, accelerating compliance testing, and improving workflow efficiency for high speed digital validation.

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Molex Impress Moves 224G Links Onto the ASIC Substrate

TE Connectivity MezzaWave Connectors Aim at Denser 56G Links

Samtec AcceleRate Slim Cables Add More Flexible Signal Routing

Samtec’s 0.80 mm Edge-Card Sockets Target High-Speed Modular Designs

Keysight HDMI 2.2 Test Solution Targets 8K and Beyond

Toshiba expands digital isolators for stable industrial control

Diodes Introduces Tiny eUSB2-to-USB 2.0 Repeaters for Compact Embedded Systems

Diodes PI2MEQX2505Q Improves MIPI D-PHY Signal Integrity In High Resolution Automotive Cameras

TE Connectivity Launches Ultra Low-Profile PCIe Gen 7 Connectors for AI and Data Centers

Keysight XR8 Scope Architecture Pushes High Speed Validation Forward

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