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TDK’s μPOL FS1525 Pushes Vertical Power Delivery Toward 200 A Density

TDK’s FS1525 μPOL module delivers 25 A per unit and scales to 200 A for vertical power delivery, integrating magnetics, MOSFETs and control in a compact package for AI, FPGA and data center platforms.

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Microchip Power Module Lifts AI Server Density With Vertical Architecture

Microchip’s MCPF1525 power module provides 25A per device, stackable to 200A, with PMBus control, low noise performance and a vertical package that improves board density for AI, HPC and PCIe based compute systems.

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