Latest News

The latest electronics news, featuring updates and announcements from leading companies in the electronic components industry. Stay informed on product releases, industry trends, and market insights.

Not A Member? Join The Club Now!

EPC91122 from EPC Puts GaN Motor Drive Inverter Inside Robotic Joints

EPC’s EPC91122 integrates a complete 3 phase BLDC motor drive inverter inside a compact circular form factor for humanoid joints, combining GaN switching, onboard control, sensing, and communication to deliver high current in limited space.

EPC, EPC91122, EPC33110, GaN inverter, BLDC motor drive, humanoid robotics, integrated motor controller, three phase motor control, GaN power stage, high frequency switching, motion control, robotic joints, servo drive design, compact motor inverters, electromechanical systems, actuator design

EAO Series 82 Switch Updates Bring New Options for Harsh Environment HMIs

EAO expands its Series 82 HMI range with new selector and keylock switches built for harsh environments. The updated designs improve durability, visibility, and access control for industrial and food-processing equipment.

EAO, Series 82, HMI switch, selector switch, keylock switch, stainless steel actuator, harsh environment HMI, industrial control, food processing equipment, corrosion resistance, tactile switch design, access control hardware, panel design, machine control, operator interface components

Keysight XR8 Scope Architecture Pushes High Speed Validation Forward

Keysight’s Infiniium XR8 oscilloscope introduces a new front end with integrated ADC and DSP processing, reducing noise, accelerating compliance testing, and improving workflow efficiency for high speed digital validation.

Keysight, Infiniium XR8, oscilloscope, high speed digital, signal integrity, jitter analysis, USB4v2 testing, DisplayPort 2.1, DDR5 validation, ADC design, DSP engine, compliance testing, electronic design, measurement tools, test and measurement, lab workflow

Vishay 0201 AEC Q200 Resistors for High Density Designs

Vishay’s CRCW0201 AT 0201 AEC Q200 thick film resistors support high density automotive and industrial designs with stable electrical behavior, predictable drift and reliable assembly performance.

Vishay, CRCW0201 AT, 0201 resistors, thick film resistor, AEC Q200 resistor, high density PCB design, automotive electronics, compact passives, resistor temperature drift, PCB routing constraints, passive component reliability, telecommunications hardware, industrial controllers, snap in assembly, matte tin plating, reflow compatible resistor, high density surface mount design

TDK B43655 and B43656 DC Link Capacitors for EV On-Board Chargers

TDK’s B43655 and B43656 DC link capacitors bring compact sizing, high ripple tolerance and base-cooling optimization to 800V EV on-board chargers, supporting reliable high-power operation.

TDK, B43655, B43656, DC link capacitor, EV chargers, on board charger, OBC capacitor, aluminum electrolytic capacitor, high ripple current, 800V battery systems, base cooling design, forced cooling capacitor, AEC Q200, snap in capacitor, low ESR capacitor, high voltage capacitor, e mobility power, EV power electronics, capacitor thermal performance

Torex XM981A Enables 48V to 12V Conversion Without Inductors

Torex XM981A is a 60V, 6A inductor-less charge pump module that converts 48V to 12V with up to 96.5% efficiency, enabling compact intermediate bus design and scalable current for industrial and communication systems.

Torex Semiconductor, XM981A, charge pump module, 48V power system, 12V intermediate bus, 60V converter, inductor-less DC converter, industrial power design, communication equipment power, intermediate bus architecture, LGA power module, high efficiency converter, 6A power module, parallel power scaling, compact power supply, 48V migration, low profile power module

Molex Impress Moves 224G Links Onto the ASIC Substrate

Molex launches Impress Co-Packaged Copper, a compression-attached substrate connector delivering 224G PAM-4 near-ASIC connectivity to reduce PCB loss and support next-generation AI and hyperscale data center architectures.

Molex, Impress Co-Packaged Copper, co-packaged optics, co-packaged copper, 224G PAM-4, near ASIC connectivity, high-speed interconnect, data center networking, AI accelerators, hyperscale architecture, substrate connector, compression connector, SerDes, 3.2T networking, signal integrity, PCB loss reduction, high-density server design

TDK NTCSP Thermistors Push to 175 C Automotive Operation

TDK expands its NTCSP automotive NTC thermistor series to 175 C operation with AgPd terminations for conductive glue mounting, AEC Q200 qualification, and compact 1.6 x 0.8 mm packaging for power modules and high temperature sensing.

TDK, NTC thermistor, NTCSP series, automotive temperature sensor, AEC Q200, high temperature electronics, 175 C operation, conductive glue mounting, AgPd terminals, power semiconductor monitoring, EV power module, ABS electronics, transmission control, engine electronics, thermal compensation, B constant, 10k thermistor, 100k thermistor

Renesas Chiplet SoC Tech for Automotive SDV ECUs

Renesas develops automotive SoC technologies for SDV-era multi-domain ECUs, combining chiplet safety across UCIe, expanded AI NPUs, and advanced multi-domain power control.

Renesas, multi-domain ECU, automotive SoC, SDV architecture, chiplet automotive, UCIe interface, RegionID isolation, ASIL D, functional safety SoC, R-Car X5H, AI NPU automotive, advanced clock architecture, power gating automotive, IR drop reduction, dual core lock step, automotive semiconductor technology, ISSCC 2026, automotive E/E architecture

Renesas 3nm TCAM Architecture Targets Automotive SoCs

Renesas introduces a 3nm FinFET TCAM architecture achieving 5.27 Mb/mm² density, 0.167 fJ per bit search energy, and enhanced functional safety for automotive SoCs, presented at ISSCC 2026.

Renesas, 3nm TCAM, automotive SoC, FinFET memory, ISSCC 2026, ISO 26262, functional safety memory, embedded TCAM, low power TCAM, high density memory, search acceleration, ECC architecture, automotive semiconductor, advanced node memory, 1.7GHz TCAM, cloud edge networking, content addressable memory, semiconductor research, high speed SoC memory

1 …10 11 12 13 14 …59