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Power Integrations Pushes Flyback Into 440 W Range

Power Integrations has introduced TOPSwitchGaN flyback ICs that push offline flyback power supplies to 440 W, offering a simpler alternative to resonant and LLC designs in appliances, e-bike chargers, and industrial systems.

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Microchip Shrinks The HMI Memory Problem In Vehicles

Microchip’s automotive-qualified SAM9X75D5M hybrid MCU combines an Arm926EJ-S processor and 512 Mbit DDR2 SDRAM in one package for cockpit displays, smart clusters, HVAC controls, and EV charger HMIs.

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Alibaba Reveals New CPU for AI Agents Using RISC-V

Alibaba has recently announced its latest AI accelerator, leveraging the RISC-V ISA for its open-source capabilities and ease of development. How has RISC-V risen in the industry, why is Alibaba using it, and could RISC-V dominate the future AI market?

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New Radiation-Resistant Wi-Fi Chip Could Power Nuclear Robotics

Recently, researchers created a Wi-Fi solution capable of operating in extreme radiation environments. What challenges does radiation present, what did the researchers develop, and why is it so exciting?

wireless, rf, silicon, radiation, rad, nuclear, industry, interference

SemiQ Dual3 SiC Modules Push IGBT Drop-In Further

SemiQ’s 1200 V QSiC Dual3 half-bridge modules combine low RDSon SiC MOSFETs, optional Schottky diodes, and high power density to help replace IGBT modules in data center cooling, energy storage, and industrial power converters.

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Toshiba Wettable-Flank MOSFETs Shift Package Priorities

Toshiba has launched five automotive MOSFETs in its DFN2020B(WF) package, combining wettable flanks, better AOI visibility, stronger solder-joint performance, and a smaller footprint for compact vehicle power designs.

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EPC GaN Inverter Board Targets Faster BLDC Prototyping

EPC’s EPC91121 gives engineers a compact three-phase GaN inverter platform for 24 V-class BLDC development, combining 50 ARMS output, integrated sensing, controller support, and switching up to 150 kHz.

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TI Pushes Isolated Power Density For EVs And Data Centers

TI’s UCC34141-Q1 and UCC33420 isolated power modules use IsoShield packaging to combine a planar transformer and isolated power stage, targeting compact automotive, industrial, and data center rails with up to 2 W output power.

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China Unveils Worlds-First 35 Micron Ultra-Thin Power Wafer Production Line

Recently, China announced that it has developed the world's thinnest power wafers at 35 microns. But why exactly does this matter, how has China achieved this, and what does it mean for the rest of the world?

Power electronics, Energy distribution, Semiconductor wafers, Wafer thickness, Bulk electrical resistance, Thermal properties, 35 micron wafers, China semiconductor industry, Advanced chipmaking technologies, EV fast chargers.

Renesas GaN Charging Topology Pushes Compact Power Higher

Renesas has expanded its AC/DC charging portfolio with a GaN-based half-wave LLC platform built around the RRW11011 and companion controllers, targeting compact 100 W to 500 W plus chargers with 5 V to 48 V output capability.

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Power Integrations Pushes Flyback Into 440 W Range

Microchip Shrinks The HMI Memory Problem In Vehicles

Alibaba Reveals New CPU for AI Agents Using RISC-V

New Radiation-Resistant Wi-Fi Chip Could Power Nuclear Robotics

SemiQ Dual3 SiC Modules Push IGBT Drop-In Further

Toshiba Wettable-Flank MOSFETs Shift Package Priorities

EPC GaN Inverter Board Targets Faster BLDC Prototyping

TI Pushes Isolated Power Density For EVs And Data Centers

China Unveils Worlds-First 35 Micron Ultra-Thin Power Wafer Production Line

Renesas GaN Charging Topology Pushes Compact Power Higher

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