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Microchip’s Full-Stack Edge AI Platform Brings Real Intelligence To Low-Power MCUs And MPUs

Microchip’s full stack edge AI platform brings pre trained models, application code and unified tools to its MCUs, MPUs and FPGAs, enabling secure, efficient and production ready intelligence directly at the edge for industrial, automotive and IoT systems.

Microchip, edge AI, MCU, MPU, embedded AI, ML inference, real time analytics, MPLAB X, Harmony framework, MPLAB ML, VectorBlox, FPGA acceleration, predictive maintenance, arc fault detection, facial recognition, keyword spotting, IoT, industrial automation, on device intelligence

Navitas’ 10 kW GaN Converter Pushes HVDC Data Centers Toward Higher Power Density

Navitas’ 10 kW GaN based DC DC converter delivers 98.5 percent peak efficiency and high power density for 800 V DC and plus minus 400 V DC data centers, supporting fast switching and dynamic AI workloads.

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NVIDIA’s Upcoming N1X ARM Processor

Explore the rise of custom silicon, NVIDIA’s N1X/N1 chips, and the impact on gaming, AI, and competition with Intel and AMD.

custom silicon, custom chips, semiconductor design, NVIDIA N1X, NVIDIA N1, Arm processors, MediaTek collaboration, TSMC 3nm, AI processors, high-performance laptops, integrated CPU GPU, gaming laptops, edge computing, Intel competition, AMD competition, mobile computing, AI computing, RISC-V, ARM soft cores, chip manufacturing, semiconductor trends

Researchers Create Flexible AI Chip For Smart Wearables

Researchers develop FLEXI, a flexible AI chip for wearables, enabling local computation, extreme bending tolerance, and energy-efficient edge intelligence.

flexible electronics, wearable AI, FLEXI chip, LTPS, low-power computing, edge AI, smart textiles, autonomous wearables, flexible PCB, bendable electronics, human-centric devices, sensor integration

Could X-Ray Lithography Be The Key To Future Semiconductors

As extreme ultraviolet lithography approaches its physical limits, the semiconductor industry looks beyond EUV toward X-ray lithography and alternative scaling strategies, exposing the growing challenges of sub-nanometer manufacturing.

EUV lithography, extreme ultraviolet, semiconductor manufacturing, chip fabrication, sub-nanometer nodes, X-ray lithography, ASML, Moore’s Law, transistor scaling, advanced packaging, chiplets, die stacking, optical interconnects, future of semiconductors

Japanese Enthusiast Builds 128-Byte USB Drive Using Magnetic Core Memory

A Japanese enthusiast builds a functional 128-byte USB storage device using magnetic core memory, combining 1950s-era RAM technology with modern electronics to demonstrate why core memory was replaced by semiconductor DRAM.

magnetic core memory, core memory, vintage computing, obsolete technology, computer history, memory technology, DRAM history, Intel 1103, retro engineering, electronics engineering, experimental hardware, USB storage, Raspberry Pi Pico, non-volatile memory, computing fundamentals

Infineon’s 1ED301xMC12I Drivers Ease The Shift Toward High Speed SiC Switching

Infineon’s 1ED301xMC12I isolated gate drivers offer opto compatible inputs, 300 kV per microsecond CMTI and precise timing for SiC MOSFETs, enabling faster switching and reliable isolation in motor drives, EV chargers and renewable energy systems.

Infineon, 1ED301xMC12I, EiceDRIVER, isolated gate driver, SiC MOSFET driver, opto emulator input, high CMTI, 300 kV us switching, gate drive timing, UL1577, IEC60747, motor drives, solar inverters, EV chargers, energy storage, power modules, parallel switch drive, PMOS sourcing, isolated control, high speed switching

TDK’s μPOL FS1525 Pushes Vertical Power Delivery Toward 200 A Density

TDK’s FS1525 μPOL module delivers 25 A per unit and scales to 200 A for vertical power delivery, integrating magnetics, MOSFETs and control in a compact package for AI, FPGA and data center platforms.

TDK, FS1525, μPOL, vertical power delivery, DC DC module, point of load, 25A converter, 200A scaling, AI processors, FPGA power, ASIC power, low ripple design, transient response, PMBus telemetry, I2C control, embedded power, server power, data center hardware, power density, chip embedded packaging

RECOM’s RPMVH Buck Modules Bring High Voltage Flexibility To Compact Designs

RECOM’s RPMVH 0.5 A buck modules support inputs up to 115 VDC and deliver regulated low voltage rails with strong thermal stability and Class B EMI performance, making them suitable for harsh industrial and high voltage environments.

RECOM, RPMVH, RPM family, buck regulator, DC DC converter, high voltage input, 115 VDC, 0.5A module, LGA package, EMI performance, EN 55032 Class B, trimmable output, power sequencing, industrial systems, thermal performance, auxiliary power, embedded designs

Apple Could Be Looking For New Chip Foundries

Apple is reportedly exploring semiconductor manufacturing options beyond TSMC as AI-driven demand reshapes the chip industry. This article examines what a potential shift to Intel foundry services means for Apple, why manufacturing flexibility matters, and how older process nodes and chiplet-based designs may play a larger role in the future of silicon production.

Apple Silicon, TSMC, Intel Foundry, Semiconductor Manufacturing, Chip Foundries, Advanced Process Nodes, Intel 18A, AI Chip Demand, Nvidia, SoC Design, Chiplets, Older Process Nodes, Semiconductor Supply Chain, Consumer Electronics, iPhone Processors, M-Series Chips

Microchip’s Full-Stack Edge AI Platform Brings Real Intelligence To Low-Power MCUs And MPUs

Navitas’ 10 kW GaN Converter Pushes HVDC Data Centers Toward Higher Power Density

NVIDIA’s Upcoming N1X ARM Processor

Researchers Create Flexible AI Chip For Smart Wearables

Could X-Ray Lithography Be The Key To Future Semiconductors

Japanese Enthusiast Builds 128-Byte USB Drive Using Magnetic Core Memory

Infineon’s 1ED301xMC12I Drivers Ease The Shift Toward High Speed SiC Switching

TDK’s μPOL FS1525 Pushes Vertical Power Delivery Toward 200 A Density

RECOM’s RPMVH Buck Modules Bring High Voltage Flexibility To Compact Designs

Apple Could Be Looking For New Chip Foundries

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