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onsemi Introduces Top Cool SiC Packaging for High Power Designs

onsemi adds a top cool T2PAK package to its EliteSiC MOSFETs, improving thermal performance and power density for EV and industrial designs.

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Nexperia 100 V CCPAK1212 MOSFETs Target 48 V Automotive Power Systems

Nexperia’s CCPAK1212 MOSFETs combine 0.99 mΩ RDS(on), 460 A current capability, and copper-clip packaging to shrink PCB space and boost efficiency.

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Microchip DualPack 3 IGBT7 Modules Boost Power Density and Simplify Design

Microchip’s DualPack 3 IGBT7 modules cut losses up to 20%, support 175 °C overload, and reduce system complexity for motor drives, renewables, and traction.

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SCHURTER FPR Fuseholder Increases Power Density in Compact Designs

SCHURTER’s FPR fuseholder delivers 30% higher power handling in the same footprint, offering higher thermal capacity without PCB redesign.

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SCHURTER ALO Fuse Series Supports 800 V EV Platforms

SCHURTER’s ALO fuses deliver up to 1000 VDC and 900 A protection, meeting global EV standards and supporting next-gen 800 V architectures.

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Bourns Announces High-Heat Thick Film Resistor Series

Bourns unveils the PF2270 resistor series in a compact TO-227 package, supporting up to 300W power dissipation and high-temperature operation.

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Renesas Launches Gen IV Plus 650V GaN FETs

Renesas unveils Gen IV Plus 650V GaN FETs for AI, EV, and industrial power—smaller die, better efficiency, and silicon driver compatibility.

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