Latest News
The latest electronics news, featuring updates and announcements from leading companies in the electronic components industry. Stay informed on product releases, industry trends, and market insights.
TE Connectivity MezzaWave Connectors Aim at Denser 56G Links
TE Connectivity has launched 56G MezzaWave connectors and cable assemblies for dense modular systems, supporting up to 56 Gbps PAM4 with open-pin-field architecture, routing flexibility, and standards-based interoperability.
Read MoreNavitas GeneSiC SiC MOSFETs Add QDPAK and Low-Profile TO-247
Navitas expands its 5th-generation GeneSiC silicon carbide MOSFET portfolio with top-side cooled QDPAK and low-profile TO-247-4L packages designed for AI data centers, grid infrastructure, and industrial power systems operating at 1200 V.
Read MoreBourns MF-LSMF Resettable Fuses Expand High-Power Protection Options
Bourns expands its MF LSMF PPTC resettable fuse line with higher hold currents, extended voltage ratings and ENIG plated SMD options designed for reliable protection in telecom, industrial and low voltage DC ports.
Read MoreJapan To Extract Rare Earth Minerals From Old Motors To Fight China
Japan is turning to recycling old motors and printed circuit boards to secure rare earth minerals like neodymium, reduce reliance on China, and strengthen its supply chain amid rising geopolitical and industrial risks.
Read MoreKontron OSM-S AM62L Brings TI Processing Into Compact Modules
Kontron’s OSM-S AM62L module brings a dual core Texas Instruments AM62L processor, scalable LPDDR4 and eMMC, dual GbE and CAN FD, and full OSM compatibility to compact embedded systems used in energy, medical, industrial and building automation designs.
Read MoreDiodes MXQ Spread Spectrum Oscillators Reduce EMI In Automotive Clocking
Diodes Incorporated’s MXQ spread spectrum oscillators reshape clock energy to reduce EMI in automotive and connected driving systems, offering multiple package sizes, programmable frequencies and stable jitter behavior for dense electronic designs.
Read MoreToshiba ST2000JXH35A 6500V IEGT Reshapes HVDC Stack Design
Toshiba’s ST2000JXH35A 6500V 2000A press pack IEGT targets HVDC transmission, STATCOM systems and industrial drives with improved turn-off margin and short-circuit withstand capability.
Read MoreNavitas GeneSiC 5th Gen SiC MOSFET Improves Switching Loss
Navitas 5th generation GeneSiC 1200V SiC MOSFET platform improves RDS(on) × QGD figure of merit, soft body diode behavior, and reliability for AI data centers, grid infrastructure, and industrial power conversion.
Read MoreAllegro MicroSystems ACS37017 Current Sensor Targets 0.55% Lifetime Accuracy
Allegro ACS37017 Hall-effect current sensor delivers 0.55% typical sensitivity error over temperature and lifetime with reinforced isolation for xEV, AI data center, and industrial power conversion systems.
Read MoreMicrochip’s Full-Stack Edge AI Platform Brings Real Intelligence To Low-Power MCUs And MPUs
Microchip’s full stack edge AI platform brings pre trained models, application code and unified tools to its MCUs, MPUs and FPGAs, enabling secure, efficient and production ready intelligence directly at the edge for industrial, automotive and IoT systems.
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