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Toshiba expands digital isolators for stable industrial control

Toshiba adds new dual channel digital isolators with high CMTI and low delay to improve signal reliability in noisy industrial environments.

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Infineon Raises the Bar in Coreless Current Sensing with New XENSIV Devices

Infineon’s new TLE4971 and TLI4971 sensors achieve 0.7 percent total error, providing high-precision, coreless current measurement for automotive and industrial power systems.

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Advantech Brings NXP i.MX 95 Power to Compact Edge Modules

Advantech’s SMARC AOM-5521 and OSM AOM-2521 modules integrate NXP’s i.MX 95 with AI acceleration, vision processing, and TSN networking for industrial edge systems.

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New transmitter could make wireless devices more energy-efficient

Wireless transmission powers modern devices but struggles with high energy demands, especially as range and bandwidth increase. MIT researchers developed a novel transmitter chip using adaptive, non-uniform modulation and advanced decoding to improve efficiency and reduce errors, promising longer battery life and enhanced performance for future 6G and IoT applications.

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Würth Elektronik Introduces New Coaxial Connectors for 50-Ω Cable Applications

Würth Elektronik introduces compact SMA, SMB, MCX, and MMCX coaxial cable connectors with gold contacts and IP67 options for RF applications.

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Tree Gum Could Be The Source To Longer Lasting Supercapacitors

A team from the University of Glasgow has developed a longer-lasting, eco-friendly supercapacitor using gum kondagogu—an organic tree extract. This breakthrough not only boosts performance but also tackles e-waste by introducing biodegradable materials into electronics. The article explores the tech, its environmental impact, and why nature might hold the key to cleaner innovation.

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Vishay Targets EV Isolation Stages with New Automotive Optocouplers

Vishay has introduced the VOWA617A and VOWA618A Automotive Grade optocouplers for EV and solar inverter isolation stages, featuring 11 mm creepage distance, 1500 Vpeak VIORM, and CTI 600 insulation performance.

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India Launches First Advanced 3D Chip Packaging Plant

Recently, India announced its plans to launch its first advanced 3D chip packaging plant to push India’s rise in the semiconductor field. What challenges do traditional chips face, what is India doing, and why is this a great sign for semiconductor development?

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KYOCERA AVX FFLK Capacitors Target Traction DC Links

KYOCERA AVX has launched the FFLK Series traction-grade DC filtering film capacitors for EV traction and industrial motor control, with 900 VDC to 3,800 VDC ratings, controlled self-healing dielectric behavior, and 100,000-hour life.

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YAGEO APCA7045 Inductor Targets Dense Power Designs

YAGEO’s APCA7045 ferrite shielded power inductor is built for compact DC-DC converters and high-current rails, combining DC bias stability, reduced magnetic leakage, automotive-grade reliability, and a wide operating temperature range for demanding power designs.

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