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KYOCERA AVX UBC Capacitors Extend Broadband Behavior To Higher Frequencies

KYOCERA AVX has expanded its 550 and 560 Series UBC multilayer ceramic capacitors with new 0402 values and higher voltage ratings, delivering stable ultra broadband performance from 7 kHz to 110 GHz for optical and RF communication systems.

KYOCERA AVX, UBC capacitors, 550 Series, 560 Series, broadband MLCC, RF capacitors, microwave components, optical communication, transimpedance amplifiers, TOSA ROSA, mmWave design, high frequency passives, RF sampling, fiber optics, 5G hardware, high bandwidth systems

Microchip Power Module Lifts AI Server Density With Vertical Architecture

Microchip’s MCPF1525 power module provides 25A per device, stackable to 200A, with PMBus control, low noise performance and a vertical package that improves board density for AI, HPC and PCIe based compute systems.

Microchip, MCPF1525, power module, DC DC converter, vertical power module, 25A converter, stackable power, PMBus control, I2C control, AI servers, HPC power, PCIe switch power, low noise inductor, high density power design, data center electronics, embedded EEPROM, thermal management

ROHM Expands Its Nano Cap LDO Line With Higher Current Support

ROHM’s BD9xxN5 LDO regulators deliver stable 500 mA output using sub microfarad capacitors, improving flexibility for compact automotive and industrial designs.

ROHM, BD9xxN5, Nano Cap, LDO regulator, 500mA, low noise power, MLCC stability, 12V systems, 24V systems, automotive electronics, industrial control, HTSOP J8, TO252, TO263, SPICE model, power regulation

Nexperia Supply Chain Conditions Shift Going Into 2026

ASC Global outlines how Nexperia’s manufacturing divide is creating new sourcing and qualification risks across automotive and industrial electronics.

ASC Global, Nexperia, supply chain risk, wafer provenance, automotive electronics, AEC Q101, discrete semiconductors, logic devices, manufacturing oversight, qualification drift, reliability testing, Malaysia production, procurement planning, industrial electronics, component sourcing, semiconductor supply

Cree LED Expands Into Fully Assembled L2 PCBA Platforms for Lighting Manufacturers

Cree LED’s L2 PCBAs provide ready made LED assemblies for indoor and outdoor lighting, reducing development time and complexity.

Cree LED, L2 Solutions, LED PCBA, LED modules, J Series 2835, J Series 5050, XLamp, indoor lighting, outdoor lighting, LED arrays, lighting design, PCB assemblies, CCT options, CRI performance, semiconductor lighting, luminaire development, integrated LED modules

Chinese Researchers Create New 3D DRAM Technology

DRAM underpins modern computing, but traditional planar designs are struggling to scale as memory demands rise. Researchers at IME CAS have unveiled a novel 3D DRAM architecture using a dual-gate 4F2 2T0C cell, enabling higher density, multi-level storage, and improved performance, potentially paving the way for dramatically larger RAM capacities.

DRAM, 3D DRAM, memory technology, semiconductor research, high density memory, IME CAS, Chinese research, 3D memory, HBM, Hybrid Memory Cube, RAM scaling, computer memory, advanced semiconductors

Diodes DXTN/P 78Q and 80Q BJTs Reduce Losses in Automotive Power

Ultra low VCE(sat) BJTs from Diodes reduce heat and improve efficiency in compact automotive power and control circuits.

tags diodes incorporated, dxtn/p 78q, dxtn/p 80q, bipolar transistors, npn pnp bjts, ultra low vcesat, automotive power switching, powerdi 3333

SemiQ Gen3 SiC Modules Push Current Density for High Power Systems

New SiC power modules offer high current capability and low thermal resistance for EV and industrial systems.

semiq, qsic, gen3 sic, sic module, half bridge, full bridge, six pack, high power conversion, ev charging, energy storage, industrial drives, 1200 v mosfet

Navitas Introduces 3300 V and 2300 V UHV SiC Platform For Demanding Power Systems

Navitas adds 3300 V and 2300 V SiC devices with advanced field control and robust packaging for demanding high voltage power systems.

navitas, genesic, silicon carbide, sic mosfet, 3300 v, 2300 v, sicpak g+, power modules, high voltage design, energy infrastructure, ai datacenter power, renewables, battery storage, semiconductors

Bourns Introduces Digital Current Sensors for Higher Amperage Systems

Bourns launches the SSD-1000A digital current sensors with ±0.1% accuracy, CANbus and RS-485 options for EV charging, renewables and industrial drives.

bourns, ssd-1000a, current sensor, digital sensing, canbus, rs-485, modbus rtu, shunt measurement, ev charging, renewable energy, battery management, motor drives, industrial automation, power monitoring, high current systems

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