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Does China’s Zombie Fabs Threaten Its Semiconductor Capabilities?

China’s semiconductor ambitions have faced billions in wasted investment and a trail of abandoned fabs, challenging its drive for self-reliance. But are these costly setbacks merely growing pains on the path to true technological independence, or signs of deeper struggles ahead?

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Intel Breaking the 2nm Barrier with Panther Lake on 18A Process

As the semiconductor industry pushes beyond 2nm toward angstrom-class technologies, manufacturing faces extreme physical, economic, and scientific limits. This article explores sub-2nm scaling challenges, quantum effects, EUV and high-NA lithography costs, Intel’s 18A Panther Lake ambitions, foundry expansion in the US, and why future progress may rely on chiplets, 3D packaging, and new integration strategies rather than simple transistor shrinking.

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Malaysia Looks Towards Self-Made 3nm Chips

As Malaysia looks towards creating its own 3nm chips, the future of semiconductors in the country looks positive. But while its collaboration with ARM is certainly interesting, it’s also unusual for its choice of ARM over RISC-V. What challenges do countries like Malaysia face, what exactly is it doing with ARM, and why could RISC-V have been a better choice?

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China US Tariffs – China Changes Definition of Origin to hurt US suppliers

China’s new chip-origin rules target U.S. semiconductor exports by basing import duties on wafer fabrication location, undermining American chipmakers’ access to the Chinese market. While the U.S. scrambles with reactive policy, China’s long-term semiconductor strategy is paying off—posing serious challenges for American suppliers and exposing flaws in short-sighted trade war tactics.

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Could Russia Jump Over EUV and Straight Into X-Ray Lithography?

With recent reports revealing that Russia may be looking to skip EUV and go straight into X-Ray lithography, many are wondering if they will achieve it, and if so, what that means for the rest of the world. What challenges do countries like Russia currently face, what has been revealed, and could we be entering the next phase of semiconductor manufacturing?

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Navitas Introduces 3300 V and 2300 V UHV SiC Platform For Demanding Power Systems

Navitas adds 3300 V and 2300 V SiC devices with advanced field control and robust packaging for demanding high voltage power systems.

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Renesas Powers 800V Direct Current Architecture for AI Data Centres

Renesas’ GaN FETs and power semiconductors enable efficient 800V DC distribution in AI data centres, improving power density and reducing energy losses.

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Renesas Expands Magnet-Free Inductive Position Sensor Line for Automation and Robotics

Renesas’ new inductive position sensors provide accurate, magnet-free motion feedback for robotics and automation, supported by an online coil design tool.

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Microchip’s 3 nm PCIe Gen 6 Switch Targets AI Data Flow Bottlenecks

Microchip’s Switchtec Gen 6 PCIe switches improve bandwidth and latency in AI and HPC systems with 3 nm design, 160 lanes, and secure boot features.

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Rapidus May Have Surpassed Intel 18A Logic Density

As semiconductor nodes shrink to 2nm and beyond, does smaller always mean better? Can raw logic density now define performance more than transistor size? And as companies like Rapidus challenge Intel and TSMC, who will ultimately produce the most cost-effective, reliable devices for modern applications?

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