Latest News
The latest electronics news, featuring updates and announcements from leading companies in the electronic components industry. Stay informed on product releases, industry trends, and market insights.
EPC Reveals GaN Motor Drive for Humanoid Robots and UAVs
EPC’s new GaN-powered EPC91118 reference design delivers 15 ARMS per phase in a compact 32 mm board for humanoid joints and drones.
Read MoreInfineon Raises SiC Module Temperature Limit To 205°C For EV Inverters
Infineon has introduced the FS01M9R13A7MA2B, a 1300 V HybridPACK Drive silicon carbide power module supporting continuous 205°C operation and up to 15% higher output current for EV traction inverters.
Read MoreST Expands 700V PowerGaN Devices For AI And Robotics
STMicroelectronics has added seven 700V PowerGaN HEMTs to its STPOWER portfolio, targeting AI servers, robotics, industrial power systems, and high-density power conversion designs with current ratings up to 29 A.
Read MoreSamtec Adds Through-Hole Options to mPOWER Connectors
Samtec has expanded its ultra micro mPOWER connector family with through-hole PCB termination options for industrial, aerospace, and military systems requiring compact high-current interconnects with improved mechanical robustness and vibration resistance.
Read MoreTDK DC-DC Converters Remove External Power Design
TDK-Lambda CCGS DC-DC converters deliver 15 W and 30 W isolated power with no external components, reducing design complexity in industrial and automation systems.
Read MoreNew Laser-Based Wireless System Hits 360Gbps
Researchers have developed a new laser-based wireless system that achieves internet speeds exceeding 360Gbps, offering a potential alternative to traditional Wi-Fi. However, challenges such as line-of-sight requirements and deployment complexity remain. What makes this laser system different from Wi-Fi, how does it compare in terms of energy efficiency, and could it eventually replace traditional wireless technologies?
Read MoreYAGEO SCF76X Chokes For High-Current Three-Phase EMI
YAGEO’s SCF76X three-phase common mode chokes bring nanocrystalline core technology, 65 A to 110 A current handling, low DCR, and industrial-grade thermal performance to modern inverter, HVAC, and power conversion designs.
Read MoreMurata Pushes More Automotive Capacitance Into Smaller Packages
Murata has started mass production of seven automotive MLCCs that push more capacitance into smaller case sizes, giving ADAS and in-vehicle power designers more layout freedom without stepping back on voltage rating.
Read MoreDigiKey Launches Engineering Unlocked Video Series
DigiKey has launched Engineering Unlocked, a three-part video series sponsored by Microchip and Molex covering prototyping, tools, and STEM.
Read MoreNavitas GeneSiC SiC MOSFETs Add QDPAK and Low-Profile TO-247
Navitas expands its 5th-generation GeneSiC silicon carbide MOSFET portfolio with top-side cooled QDPAK and low-profile TO-247-4L packages designed for AI data centers, grid infrastructure, and industrial power systems operating at 1200 V.
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