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Vishay VODA1275 Cuts Driver Count In HV Switching

Vishay’s VODA1275 is an automotive-grade photovoltaic MOSFET driver built for high-voltage EV and HEV systems. With 20 V typical open-circuit voltage, reinforced isolation, and 8 mm creepage, it helps reduce driver count in pre-charge, charger, and BMS designs.

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Texas Instruments TinyEngine NPU Pushes AI Into MCU Designs

Texas Instruments introduces MSPM0G5187 and AM13Ex microcontrollers integrating the TinyEngine NPU, enabling low-latency edge AI inference in embedded systems including motor control, wearables and industrial devices.

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TDK MT40 ThermoFuse Varistor Handles 50 kA Surges

TDK introduces the MT40 ThermoFuse varistor series with integrated thermal disconnect and surge handling capability up to 50 kA for industrial power and surge protection systems.

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YAGEO PTLA Transformer Integrates Resonant Inductance For LLC

YAGEO expands its power magnetics portfolio with the PTLA / PTLC Series LLC transformers delivering up to 3.6 kW while integrating resonant inductance directly into the magnetic structure to reduce component count and improve power density.

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TDK HWS3000GT4 Extends Three Phase Power Flexibility In Industrial Systems

TDK has expanded its HWS3000 programmable AC DC power supply series with the HWS3000GT4, offering a 340 to 528 Vac three phase input, full CV and CC programmability, compact power density and scalable operation for industrial and test systems.

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EAO Series 82 Switch Updates Bring New Options for Harsh Environment HMIs

EAO expands its Series 82 HMI range with new selector and keylock switches built for harsh environments. The updated designs improve durability, visibility, and access control for industrial and food-processing equipment.

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TDK B43655 and B43656 DC Link Capacitors for EV On-Board Chargers

TDK’s B43655 and B43656 DC link capacitors bring compact sizing, high ripple tolerance and base-cooling optimization to 800V EV on-board chargers, supporting reliable high-power operation.

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China Moving Towards Liquid Cooling For New Datacenters

China’s rapid AI expansion is driving server power and thermal densities beyond the limits of air cooling, forcing a nationwide shift to liquid-cooled data centres. This article examines China’s semiconductor constraints, the rise of companies like Envicool and Sanhua, government initiatives, and why liquid cooling is becoming essential for next-generation high-performance computing.

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Microchip’s Full-Stack Edge AI Platform Brings Real Intelligence To Low-Power MCUs And MPUs

Microchip’s full stack edge AI platform brings pre trained models, application code and unified tools to its MCUs, MPUs and FPGAs, enabling secure, efficient and production ready intelligence directly at the edge for industrial, automotive and IoT systems.

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RECOM High-Density DIN Rail Supply Widens Power Margin in Compact Panels

RECOM’s RACPRO1-S240 DIN rail supply provides 240W continuous output, a 150 percent peak power window, wide input flexibility and up to 95 percent efficiency to support industrial, automation and infrastructure systems where cabinet space and thermal margin are limited.

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