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Bourns GDT225HE Gas Discharge Tubes Improve Protection in High-Energy Power Systems

The Bourns GDT225HE Series high-voltage gas discharge tubes provide up to 60 kA surge handling, broad 1000–2000 V breakdown range, and compact PCB-friendly packages, offering strong protection for EV chargers, BESS systems, and industrial power equipment.

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EPC91122 from EPC Puts GaN Motor Drive Inverter Inside Robotic Joints

EPC’s EPC91122 integrates a complete 3 phase BLDC motor drive inverter inside a compact circular form factor for humanoid joints, combining GaN switching, onboard control, sensing, and communication to deliver high current in limited space.

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TDK B43655 and B43656 DC Link Capacitors for EV On-Board Chargers

TDK’s B43655 and B43656 DC link capacitors bring compact sizing, high ripple tolerance and base-cooling optimization to 800V EV on-board chargers, supporting reliable high-power operation.

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Torex XM981A Enables 48V to 12V Conversion Without Inductors

Torex XM981A is a 60V, 6A inductor-less charge pump module that converts 48V to 12V with up to 96.5% efficiency, enabling compact intermediate bus design and scalable current for industrial and communication systems.

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Renesas 3nm TCAM Architecture Targets Automotive SoCs

Renesas introduces a 3nm FinFET TCAM architecture achieving 5.27 Mb/mm² density, 0.167 fJ per bit search energy, and enhanced functional safety for automotive SoCs, presented at ISSCC 2026.

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Allegro MicroSystems ACS37017 Current Sensor Targets 0.55% Lifetime Accuracy

Allegro ACS37017 Hall-effect current sensor delivers 0.55% typical sensitivity error over temperature and lifetime with reinforced isolation for xEV, AI data center, and industrial power conversion systems.

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Infineon’s 1ED301xMC12I Drivers Ease The Shift Toward High Speed SiC Switching

Infineon’s 1ED301xMC12I isolated gate drivers offer opto compatible inputs, 300 kV per microsecond CMTI and precise timing for SiC MOSFETs, enabling faster switching and reliable isolation in motor drives, EV chargers and renewable energy systems.

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Apple Could Be Looking For New Chip Foundries

Apple is reportedly exploring semiconductor manufacturing options beyond TSMC as AI-driven demand reshapes the chip industry. This article examines what a potential shift to Intel foundry services means for Apple, why manufacturing flexibility matters, and how older process nodes and chiplet-based designs may play a larger role in the future of silicon production.

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Cree LED OptiLamp Pixels Bring Integrated Control To Modern Displays

Cree LED’s OptiLamp devices integrate driver and control logic inside each pixel, enabling smoother visuals, lower power use, true 1 to 1 scan behavior and simpler display architectures for large and small format systems.

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Cadence Launches HiFi iQ DSP for Next Generation Voice AI and Audio Processing

Cadence’s HiFi iQ DSP brings higher AI and audio performance for next generation voice and immersive sound applications.

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