News | The Component Club

Alphawave Semi Brings UCIe 3D Chiplet IP to TSMC’s 3DFabric Platform

Alphawave Semi tapes out UCIe 3D IP on TSMC’s SoIC-X 3DFabric, offering 10× power efficiency and 5× signal density for AI and HPC chiplet designs.

alphawave semi, ucie, 3dfabric, tsmc soic-x, 3d stacking, chiplet, die-to-die, ai, hpc, semiconductor packaging, semiconductors

Nexperia’s ASFETs Improve Dynamic Current Sharing in High-Power 48 V Systems

Nexperia’s new 80 V and 100 V ASFETs reduce current imbalance in parallel MOSFET designs, simplifying motor drives and industrial 48 V applications.

nexperia, asfet, mosfet, dynamic current sharing, lfpak88, motor drives, electric vehicles, industrial motors, threshold voltage, current delta, power efficiency

Semtech Expands LoRa Gen 4 with LR2022 and LR2012 Transceivers

Semtech’s new LR2022 and LR2012 transceivers bring dual-band and high-sensitivity options to LoRa Gen 4, targeting edge AI, drones, and long-range IoT.

semtech, lora, lorawan, iot connectivity, edge ai, transceiver, lr2021, lr2022, lr2012, wireless communication, industrial iot, smart sensors, predictive maintenance

TDK Introduces SmartMotion ICM-45685 IMU for Next-Generation Smart Glasses

TDK’s new ICM-45685 SmartMotion IMU delivers precise head tracking, OIS/EIS, and activity recognition for AR and AI glasses at ultra-low power.

tdk, smartmotion, icm-45685, imu, mems, ar glasses, smart glasses, wearables, motion tracking, sensor fusion

Wolfspeed Launches 200 mm SiC Wafers for High-Volume Power Device Production

Wolfspeed’s 200 mm SiC wafers and epitaxy are now commercially available, improving yields and scalability for power electronics makers worldwide.

wolfspeed, silicon carbide, 200mm, sic wafers, power devices, mosfet yield, automotive, ev, renewables, power electronics

SK hynix Completes HBM4 Development and Prepares for Mass Production

SK hynix has completed HBM4 development, doubling bandwidth and improving power efficiency by 40% to support growing AI workloads.

sk hynix, hbm4, high bandwidth memory, ai infrastructure, data center, mr-muf, dram, memory packaging, 2, 048 i/o, semiconductor manufacturing

Nexperia Brings MLPAK MOSFETs to Automotive Designs

Nexperia’s new MLPAK33-WF and MLPAK56-WF MOSFETs save board space while maintaining thermal and electrical performance for automotive power designs.

nexperia, mlpak, mlpak33-wf, mlpak56-wf, mosfet, automotive, zonal architecture, body control, lighting, reverse battery protection, dc/dc converter, aec-q101, wettable flank

Murata Digital Output PIR Sensor for Low Power IoT

Murata introduces the IRS-D200ST00R1, a compact digital PIR sensor with low power consumption and simplified I²C integration.

murata, irs-d200st00r1, pir sensor, infrared, pyroelectric, motion detection, iot, low power, i²c, smart home, smart building

UltraRAM Technology Now Volume Scales, The Future of Memory

As UltraRAM moves into production, many are left wondering if it could become the future memory technology. What challenges does memory face, what is UltraRAM, and could it be the solution for the future?

ultraram, unified memory, dram, nand flash, non-volatile memory, gallium antimonide, aluminum antimonide, epitaxy, resonant tunneling, memory hierarchy, semiconductor memory, memory scalability, high-speed memory, long-term data retention, memory endurance, memory architecture, cpu cache, storage technology, next-generation memory, memory production, memory innovation

Würth Elektronik Adds New Packages to WE-CMDC Choke Series

Würth Elektronik expands its WE-CMDC chokes with compact 7060, 9070, 1513, and 1211 packages, offering high-current EMI suppression in tight spaces.

würth elektronik, we-cmdc, common-mode choke, emi suppression, dc/dc converter, aec-q200, automotive, industrial electronics, iot, poe

Alphawave Semi Brings UCIe 3D Chiplet IP to TSMC’s 3DFabric Platform

Nexperia’s ASFETs Improve Dynamic Current Sharing in High-Power 48 V Systems

Semtech Expands LoRa Gen 4 with LR2022 and LR2012 Transceivers

TDK Introduces SmartMotion ICM-45685 IMU for Next-Generation Smart Glasses

Wolfspeed Launches 200 mm SiC Wafers for High-Volume Power Device Production

SK hynix Completes HBM4 Development and Prepares for Mass Production

Nexperia Brings MLPAK MOSFETs to Automotive Designs

Murata Digital Output PIR Sensor for Low Power IoT

UltraRAM Technology Now Volume Scales, The Future of Memory

Würth Elektronik Adds New Packages to WE-CMDC Choke Series

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