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Filtering by tag: "semiconductor manufacturing"

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GlobalFoundries and Navitas Advance U.S. GaN Manufacturing for AI Datacenters and High-Power Systems

GlobalFoundries and Navitas form a long-term partnership to expand U.S. GaN technology and manufacturing for AI datacenters, energy and high-power systems.

globalfoundries, navitas semiconductor, gan, gan-on-si, ai datacenters, power electronics, high voltage, energy infrastructure, semiconductor manufacturing, power conversion, data center hardware

SK hynix Completes HBM4 Development and Prepares for Mass Production

SK hynix has completed HBM4 development, doubling bandwidth and improving power efficiency by 40% to support growing AI workloads.

sk hynix, hbm4, high bandwidth memory, ai infrastructure, data center, mr-muf, dram, memory packaging, 2, 048 i/o, semiconductor manufacturing

Applied Materials Advances GAA Transistor Engineering For Faster AI Chips At 2nm And Beyond

Applied Materials introduces new deposition, etch and radical treatment systems that improve GAA transistor nanosheets, reduce contact resistance and enhance trench precision for 2nm and angstrom class AI chips, boosting energy efficient compute performance.

Applied Materials, GAA transistors, nanosheets, 2nm process, angstrom era, transistor engineering, radical treatment, Viva system, Sym3 Z Magnum, Spectral ALD, molybdenum contacts, tungsten replacement, plasma etch control, AI chips, semiconductor manufacturing, device scaling, advanced logic nodes, materials engineering

Could X-Ray Lithography Be The Key To Future Semiconductors

As extreme ultraviolet lithography approaches its physical limits, the semiconductor industry looks beyond EUV toward X-ray lithography and alternative scaling strategies, exposing the growing challenges of sub-nanometer manufacturing.

EUV lithography, extreme ultraviolet, semiconductor manufacturing, chip fabrication, sub-nanometer nodes, X-ray lithography, ASML, Moore’s Law, transistor scaling, advanced packaging, chiplets, die stacking, optical interconnects, future of semiconductors

TI DLP Technology Pushes Maskless Lithography Toward Advanced Packaging

Texas Instruments’ DLP991UUV micromirror device delivers 8.9 MP resolution and sub-micron precision for advanced packaging and digital lithography.

texas instruments, ti, dlp991uuv, dlp technology, digital lithography, maskless lithography, advanced packaging, semiconductor manufacturing, data centres, 5g

Researchers Stack Active Chip Layers To Increase Transistor Count

As researchers approach the fundamental limits of transistor design, some are now looking to go up rather than down. What challenges does chip stacking face, what have researchers recently demonstrated, and why is this the future of semiconductor technologies?

chip stacking, 3D integrated circuits, monolithic 3D integration, active semiconductor layers, transistor density, vertical chip scaling, semiconductor manufacturing, CMOS stacking, nanomembrane transfer, thermal budget limitations, junctionless transistors, device density, Moore's Law, memory density, processor core count