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EPC Demonstrates 800 V To 12.5 V AI Power Converter Without 48 V Stage

EPC's EPC91123 evaluation board converts 800 VDC directly to 12.5 VDC at up to 6 kW, achieving 98.2% efficiency while eliminating the need for a 48 V intermediate stage.

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Micron Starts Shipping 245TB 6600 ION Data Center SSD

Micron has started shipping its 245TB 6600 ION data center SSD, targeting AI infrastructure, hyperscale storage, and cloud deployments where rack density, cooling efficiency, and power constraints are becoming major operational challenges.

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YAGEO Film Capacitors Target EMI Stress in WBG Power

YAGEO’s R41D V234 Series is a family of Y2/X1 metallized polypropylene film capacitors for EMI suppression in SiC and GaN power systems, offering 300 VAC rating, 1200 VDC recommendation, high dV/dt capability, and increased ripple current handling.

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Alpha and Omega Semiconductor MOSFETs Target AI Server Power Density

Alpha and Omega Semiconductor has introduced the AONC40202 and AONC68816 MOSFETs in DFN 3.3 x 3.3 double-sided cooling source-down packages for AI server Intermediate Bus Converter applications.

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Nanopower nPZero IC Changes How IoT Sensors Use Energy

Nanopower’s nPZero power-saving IC allows IoT devices to monitor up to four sensors while the host MCU remains powered down, reducing system energy consumption and enabling longer battery life in remote sensing applications.

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US Blocks Chinese Chip Sales To Federal Government

In a move to try and improve US Federal Government cyber-security, the US is launching a new plan to ban Chinese chips in Federal systems. What challenges does China face, what will the plans do, and why is the current market not able to support such a ban?

US-China technology conflict, semiconductor independence, Chinese silicon technologies, NVIDIA H200 chips, Chinese chips in Western systems, US plan to bar Chinese semiconductors, Federal Acquisition Regulatory Council

STMicroelectronics Scales Silicon Photonics for AI Interconnects

STMicroelectronics moves its PIC100 silicon photonics platform into high-volume 300 mm production for 800G and 1.6T optical interconnects supporting AI data center infrastructure.

STMicroelectronics, PIC100, silicon photonics, optical interconnect, AI infrastructure, hyperscale data centers, optical transceivers, 800G optics, 1.6T optics, photonic integrated circuits, silicon nitride waveguides, optical modulators, co packaged optics, near packaged optics, data center networking

RECOM RVP6501 Push-Pull Driver Supports Discrete DC/DC

RECOM introduces the RVP6501 push-pull transformer driver IC for discrete isolated DC/DC converters, delivering 500mA drive capability with adaptive dead-time control and current monitoring.

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NAND Supply Conditions Tighten Going Into 2026

Fusion Worldwide highlights tightening NAND supply as AI driven storage demand outpaces restrained production through 2026.

Fusion Worldwide, NAND, NAND flash, QLC, enterprise SSD, storage demand, AI infrastructure, DRAM comparison, wafer starts, memory supply constraints, semiconductor market, SSD capacity, component shortages, pricing trends, procurement strategy, data center storage

Toshiba and MIKROE Simplify Automotive DC Motor Prototyping

Toshiba’s SmartMCD TB9M001FTG board streamlines development of dual brushed DC motor control systems.

Toshiba, Toshiba Electronic Devices and Storage Corporation, MIKROE, SmartMCD, TB9M001FTG, motor driver, brushed DC motor, automotive electronics, body control module, LIN transceiver, Arm Cortex M0, AEC Q100, ASIL A, relay motor control, power management, evaluation board, motor control design

EPC Demonstrates 800 V To 12.5 V AI Power Converter Without 48 V Stage

Micron Starts Shipping 245TB 6600 ION Data Center SSD

YAGEO Film Capacitors Target EMI Stress in WBG Power

Alpha and Omega Semiconductor MOSFETs Target AI Server Power Density

Nanopower nPZero IC Changes How IoT Sensors Use Energy

US Blocks Chinese Chip Sales To Federal Government

STMicroelectronics Scales Silicon Photonics for AI Interconnects

RECOM RVP6501 Push-Pull Driver Supports Discrete DC/DC

NAND Supply Conditions Tighten Going Into 2026

Toshiba and MIKROE Simplify Automotive DC Motor Prototyping

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