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Renesas 3nm TCAM Architecture Targets Automotive SoCs

Renesas introduces a 3nm FinFET TCAM architecture achieving 5.27 Mb/mm² density, 0.167 fJ per bit search energy, and enhanced functional safety for automotive SoCs, presented at ISSCC 2026.

Renesas, 3nm TCAM, automotive SoC, FinFET memory, ISSCC 2026, ISO 26262, functional safety memory, embedded TCAM, low power TCAM, high density memory, search acceleration, ECC architecture, automotive semiconductor, advanced node memory, 1.7GHz TCAM, cloud edge networking, content addressable memory, semiconductor research, high speed SoC memory

Cincon CFM600S Brings 600W Power Delivery to Space-Limited Systems

Cincon’s CFM600S series provides 600W power in a compact format with strong thermal behavior for dense industrial and telecom systems.

Cincon, CFM600S, AC DC power supply, 600W power supply, high density power, conduction cooled supply, thermal performance, natural convection, wide AC input, efficiency, low inrush current, auxiliary rails, industrial automation, telecom equipment, embedded systems, power design

Littelfuse 200 V X4-Class MOSFET Targets High-Current Power Systems

The Littelfuse MMIX1T500N20X4 delivers 200 V and 480 A performance with topside cooling for compact high current power systems.

littelfuse, mmix1t500n20x4, x4 class mosfet, 200 v mosfet, 480 a current, smpd x package, topside cooling, power density, energy storage, industrial charging

KYOCERA AVX Unveils LDS Cap Antenna for Reliable Iridium Satellite IoT

KYOCERA AVX’s new LDS cap antenna, qualified for Iridium Certus 9704 modules, improves gain and efficiency for compact satellite IoT devices.

kyocera avx, iridium, lds technology, satellite iot, leo satellites, antenna design, gnss, wireless connectivity, certus 9704, iot hardware

ROHM Schottky Diode Improves Protection for Image Sensors in Harsh Conditions

ROHM releases a Schottky diode combining low forward voltage and low leakage to protect ADAS and industrial image sensors.

rohm, rbe01vym6afh, schottky diode, image sensor protection, adas cameras, photovoltaic voltage, thermal stability, low leakage, sod 323he, aec q101, automotive electronics, industrial cameras, sensor module design, power protection ics, optoelectronic components

ST and Tobii Bring Single-Camera Interior Sensing to Mass Production

STMicroelectronics and Tobii have entered mass production of an interior sensing system that combines RGB and IR imaging for driver and occupant monitoring.

stmicroelectronics, tobii, vd1940, safesense, driver monitoring, occupancy monitoring, interior sensing, automotive safety, in-cabin sensing, imaging sensors

Alphawave Semi Brings UCIe 3D Chiplet IP to TSMC’s 3DFabric Platform

Alphawave Semi tapes out UCIe 3D IP on TSMC’s SoIC-X 3DFabric, offering 10× power efficiency and 5× signal density for AI and HPC chiplet designs.

alphawave semi, ucie, 3dfabric, tsmc soic-x, 3d stacking, chiplet, die-to-die, ai, hpc, semiconductor packaging, semiconductors

Voltcraft VC-900 Multimeter Series Combines Rugged Design and Smart Features

Voltcraft’s VC-900 multimeters are IP65-rated, CAT III/IV certified, and feature transflective displays, hands-free mounting, and Bluetooth data logging.

voltcraft, conrad electronic, digital multimeter, test and measurement, vc-900 series, vc-905, vc-915, ip65 multimeter, cat iv 1000v, bluetooth multimeter, data logging, electrical maintenance, industrial testing, utilities, field service

Melexis Adds External NTC Input to MLX91230 and MLX91231 IVT Sensors

Melexis adds external NTC input to its IVT sensors, improving thermal awareness and protection for EV battery systems, pyro-fuses, and BMS nodes.

melexis, mlx91230, mlx91231, ivt sensor, current sensor, battery management, pyro-fuse, dc fast charging, automotive, bess

Cadence and NVIDIA Boost Power Analysis for Billion-Gate AI Designs

Cadence and NVIDIA’s new Palladium Dynamic Power Analysis App delivers billion-gate AI power analysis in hours with 97% accuracy.

cadence, nvidia, dynamic power analysis, palladium z3, ai chip design, machine learning hardware, gpu acceleration, pre-silicon verification, power optimisation, semiconductor tools, chip design, hardware acceleration, energy efficiency

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