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TI Unveils Power Solutions for Scalable AI Data Centres

Texas Instruments introduces new power management solutions and design resources to support scalable 800V AI data centre architectures.

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EPC Highlights GaN Power Advances at PCIM Asia 2025

EPC will showcase GaN solutions for AI servers, robotics, and UAVs at PCIM Asia 2025, as momentum grows for GaN to replace silicon in high-frequency power.

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TI DLP Technology Pushes Maskless Lithography Toward Advanced Packaging

Texas Instruments’ DLP991UUV micromirror device delivers 8.9 MP resolution and sub-micron precision for advanced packaging and digital lithography.

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Samsung Electro-Mechanics Introduces Ultra-High-Capacitance 0201 MLCC for AI Servers

Samsung Electro-Mechanics new 0201 MLCC offers 4.7 µF capacitance with X6S stability, optimised for AI server density and heat management.

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