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onsemi Launches Elite Pairing Studio for SiC Power Design

onsemi has introduced Elite Pairing Studio, an online environment for evaluating SiC MOSFET and gate driver combinations. The platform provides waveform analysis, switching-loss calculations, and integration with PLECS and Elite Power Simulator workflows.

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EPC Introduces Three-Phase GaN Inverter Platforms for BLDC Motor Development

EPC has introduced the EPC91128, EPC91129, EPC91130, and EPC91131 three-phase BLDC inverter platforms. Based on EPC23108–EPC23111 ePower Stage ICs, the boards support 10V to 80V operation and output currents up to 29ARMS.

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Melexis Introduces MLX92344 Hall Switch with Four Output States Over Two Wires

Melexis has introduced the MLX92344 automotive Hall switch. The device supports up to four output states over a two-wire interface, programmable current outputs from 3mA to 28mA, and operation from -40°C to +150°C.

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Toshiba Introduces 40V Automotive MOSFETs in SOP Advance(EWF) Package

Toshiba has introduced the XPMR5904PB, XPMR7404PB, and XPMR8504PB 40V automotive MOSFETs. The devices use the new SOP Advance(EWF) package, support drain currents up to 180A, and deliver lower on-resistance and thermal impedance.

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TDK DC-Link Capacitors Target High-Frequency SiC Power Systems

TDK has introduced the B25696H series of DC-link film capacitors for SiC-based power electronics. The capacitors offer voltage ratings from 900VDC to 2000VDC, capacitance up to 1280µF, self-inductance as low as 30nH, and ripple current capability up to 91A.

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Littelfuse Adds 14kA Surface-Mount Fuse for 48VDC Systems

Littelfuse has introduced the NANO² 708 Series surface-mount fuse for 48VDC power systems. The fuse provides a 14,000A interrupting rating at 80VDC, supports current ratings from 60A to 200A, and is designed for high-current power distribution applications.

Littelfuse, NANO2, 708 Series, Fuse, Surface Mount Fuse, SMD Fuse, Overcurrent Protection, 48VDC, Data Center, AI Server, Power Distribution Unit, Battery Backup Unit, Power Supply Unit, Circuit Protection, Power Electronics, High Current, Protection Devices

Microchip Adds PCIe 6.0 and CXL 3.1 Retimers for AI Data Centers

Microchip has introduced XpressConnect PCIe 6.0 and CXL 3.1 retimers for AI servers and data center fabrics. The devices support 64 GT/s operation, sub-12ns latency, PCIe Gen 3-6 compatibility, PAM4 telemetry, and multiple link bifurcation configurations.

Microchip, XpressConnect, PCIe 6.0, CXL 3.1, Retimer, Data Center, AI Infrastructure, PCIe Gen 6, Signal Integrity, Server Architecture, PAM4, ChipLink, Switchtec, NVMe, Accelerator, GPU Cluster, High Speed Interconnect

Researchers Develop World’s First Probabilistic Bit on Regular CMOS Process

Making quantum computing components in a lab is one thing, but getting them to work using standard CMOS processes is another. Now, a team of researchers have successfully demonstrated the production of p-bits using standard CMOS technology. What challenges does the manufacture of quantum systems involve, what did the researchers develop, and how does this change the quantum game?

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Planar Vacuum Tubes Could Replace Transistors

Vacuum tubes were phased out decades ago in favour of silicon transistors. But recently, researchers demonstrates planar vacuum devices which could very well replace transistors due to their superior performance. What challenges did tubes face, what did the researchers develop, and why could they potentiall replace transistors in the future?

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ST Vibration Sensor Adds In-Sensor AI for Condition Monitoring

STMicroelectronics has introduced the IIS3DWB10IS, a MEMS vibration sensor for industrial condition monitoring. The device combines 200g vibration measurement, bandwidth above 10kHz, ISPU 2.0 processing, embedded AI inference, and operation up to 125°C in a compact LGA package.

STMicroelectronics, IIS3DWB10IS, MEMS Sensor, Vibration Sensor, Industrial Sensors, Condition Monitoring, Predictive Maintenance, ISPU 2.0, Edge AI, Machine Monitoring, FFT Analysis, Anomaly Detection, Industrial Automation, MEMS Technology, Shock Sensor, Vibration Analysis, Embedded Processing

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