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Cadence Extends AI Design Platform to PCB and Advanced Packaging

Cadence has introduced AuraStack AI Super Agent, extending its AI-assisted design platform to PCB and advanced packaging. Running on Allegro AI Studio, the software combines layout, optimisation, and multiphysics analysis in a unified workflow.

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Cadence Launches HiFi iQ DSP for Next Generation Voice AI and Audio Processing

Cadence’s HiFi iQ DSP brings higher AI and audio performance for next generation voice and immersive sound applications.

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