Latest News
The latest electronics news, featuring updates and announcements from leading companies in the electronic components industry. Stay informed on product releases, industry trends, and market insights.
Filtering by tag: "high-performance computing"
Clear tag filterEPC Launches EPC2370 GaN FET for AI Server Power
EPC starts mass production of the EPC2370 18 V GaN FET, offering 0.28 mΩ typical RDS(on), 101 A continuous current and a 22 V transient rating for high-current AI server and DC/DC power conversion.
Read MoreCadence Extends AI Design Platform to PCB and Advanced Packaging
Cadence has introduced AuraStack AI Super Agent, extending its AI-assisted design platform to PCB and advanced packaging. Running on Allegro AI Studio, the software combines layout, optimisation, and multiphysics analysis in a unified workflow.
Read MoreTektronix Brings SEPIA Power Integrity Analysis to Mixed Signal Oscilloscopes
Tektronix has introduced PDN Analysis Software for its 4 Series B, 5 Series B, and 6 Series B Mixed Signal Oscilloscopes. The software embeds SEPIA stability analysis alongside impedance, PSRR, noise, and jitter measurements to evaluate power distribution networks under real transient load conditions.
Read MorePowerLattice Develops Power Delivery Chiplet That Cuts Power by 50%
PowerLattice has emerged from stealth with a new power delivery chiplet designed for AI accelerators, GPUs, and CPUs, claiming over 50% power reduction. By integrating power delivery directly into the processor package using stacked chiplet design, on-die inductors, and software control, the approach could reshape high-performance, modular semiconductor systems.
Read More