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Cadence Extends AI Design Platform to PCB and Advanced Packaging

Cadence has introduced AuraStack AI Super Agent, extending its AI-assisted design platform to PCB and advanced packaging. Running on Allegro AI Studio, the software combines layout, optimisation, and multiphysics analysis in a unified workflow.

Cadence, AuraStack, Allegro AI Studio, PCB design, advanced packaging, EDA, electronic design automation, AI design, multiphysics analysis, signal integrity, power integrity, thermal analysis, mechanical analysis, package design, PCB layout, AI infrastructure, high-performance computing, engineering software, design automation

Infineon CoolGaN Drive HB G5 Brings Integrated Half-Bridge Control to High-Frequency Power Designs

Infineon’s CoolGaN Drive HB 600 V G5 integrates dual GaN switches, high- and low-side drivers, and a bootstrap diode into one package, enabling high-frequency motor drives and SMPS designs with reduced parasitics, lower losses, and easier PCB layout.

Infineon, CoolGaN, GaN half bridge, GaN driver, IGI60L1111B1M, IGI60L1414B1M, IGI60L2727B1M, IGI60L5050B1M, high frequency switching, SMPS, motor drive, power electronics, bootstrap diode, TFLGA package, wide bandgap, high efficiency, PCB layout, power stage integration

Cadence Extends AI Design Platform to PCB and Advanced Packaging

Infineon CoolGaN Drive HB G5 Brings Integrated Half-Bridge Control to High-Frequency Power Designs

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