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Filtering by tag: "high-speed interconnect"

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Molex Impress Moves 224G Links Onto the ASIC Substrate

Molex launches Impress Co-Packaged Copper, a compression-attached substrate connector delivering 224G PAM-4 near-ASIC connectivity to reduce PCB loss and support next-generation AI and hyperscale data center architectures.

Molex, Impress Co-Packaged Copper, co-packaged optics, co-packaged copper, 224G PAM-4, near ASIC connectivity, high-speed interconnect, data center networking, AI accelerators, hyperscale architecture, substrate connector, compression connector, SerDes, 3.2T networking, signal integrity, PCB loss reduction, high-density server design

TE Connectivity Launches Ultra Low-Profile PCIe Gen 7 Connectors for AI and Data Centers

TE Connectivity’s Ultra Low-Profile PCIe Gen 7 connectors deliver 128 GT/s performance in an 8.7 mm height, enabling compact, high-speed AI and data center designs.

te connectivity, pcie gen 7, connector, data center, ai, high-speed interconnect, server, pcb design, signal integrity, cable assemblies

Molex Impress Moves 224G Links Onto the ASIC Substrate

TE Connectivity Launches Ultra Low-Profile PCIe Gen 7 Connectors for AI and Data Centers

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