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Samtec BE71A Supports 224 Gbps PAM4 Testing

Samtec’s BE71A Bulls Eye test assembly supports 224 Gbps PAM4 SerDes characterization to 71 GHz, combining 0.5 ps phase matching, Nitrowave cable, and a 1.85 mm instrumentation interface for dense high-speed digital test setups.

Molex Impress Moves 224G Links Onto the ASIC Substrate

Molex launches Impress Co-Packaged Copper, a compression-attached substrate connector delivering 224G PAM-4 near-ASIC connectivity to reduce PCB loss and support next-generation AI and hyperscale data center architectures.

Molex, Impress Co-Packaged Copper, co-packaged optics, co-packaged copper, 224G PAM-4, near ASIC connectivity, high-speed interconnect, data center networking, AI accelerators, hyperscale architecture, substrate connector, compression connector, SerDes, 3.2T networking, signal integrity, PCB loss reduction, high-density server design

Samtec BE71A Supports 224 Gbps PAM4 Testing

Molex Impress Moves 224G Links Onto the ASIC Substrate

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