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Microchip Launches Off-the-Shelf Radiation-Hardened 15 W Power Converter for Space Applications

Microchip launches SA15‑28, a 15 W radiation-hardened DC-DC converter with EMI filter for high-reliability space and satellite power systems.

microchip, dc dc converters, radiation hardened, emi filters, satellite systems, space grade electronics, power management, aerospace applications, high reliability, mil std components

China Unveils Worlds-First 35 Micron Ultra-Thin Power Wafer Production Line

Recently, China announced that it has developed the world's thinnest power wafers at 35 microns. But why exactly does this matter, how has China achieved this, and what does it mean for the rest of the world?

Power electronics, Energy distribution, Semiconductor wafers, Wafer thickness, Bulk electrical resistance, Thermal properties, 35 micron wafers, China semiconductor industry, Advanced chipmaking technologies, EV fast chargers.

u-blox F11 GNSS Platform Balances Meter-Level Accuracy and Power

u-blox introduces the F11 GNSS platform supporting dual-band L1/L5 positioning with power consumption as low as 7 mW, targeting wearables, asset tracking, telematics and IoT devices.

u-blox, F11, GNSS receiver, dual-band GNSS, L1 L5 GNSS, satellite positioning, ultra low power GNSS, asset tracking, wearable GNSS, telematics hardware, geolocation systems, IoT tracking devices, micromobility tracking, drone navigation, embedded GNSS

YAGEO PTLA Transformer Integrates Resonant Inductance For LLC

YAGEO expands its power magnetics portfolio with the PTLA / PTLC Series LLC transformers delivering up to 3.6 kW while integrating resonant inductance directly into the magnetic structure to reduce component count and improve power density.

YAGEO, PTLA Series, PTLC Series, LLC transformer, power magnetics, resonant converter, leakage inductance, resonant inductance, EV charging power supply, AI computing power, data center power supply, telecom infrastructure power, intermediate bus converter, high power transformer, AEC Q200, automotive power electronics, server power supply, high power density magnetics, power conversion

Infineon MOTIX SiP Shrinks Automotive Motor Control Boards

The Infineon MOTIX TLE9954QSW40-33 integrates MCU, power stage and motor driver functions in a compact SiP, reducing board size and improving thermal and EMC behavior for automotive pumps, fans and actuators.

Infineon, MOTIX, TLE9954QSW40, motor control, SiP, OptiMOS 7, automotive electronics, EV thermal systems, LIN control, FOC control, compact motor driver, three phase driver, MCU integration, thermal management, EMC performance

Renesas 3nm TCAM Architecture Targets Automotive SoCs

Renesas introduces a 3nm FinFET TCAM architecture achieving 5.27 Mb/mm² density, 0.167 fJ per bit search energy, and enhanced functional safety for automotive SoCs, presented at ISSCC 2026.

Renesas, 3nm TCAM, automotive SoC, FinFET memory, ISSCC 2026, ISO 26262, functional safety memory, embedded TCAM, low power TCAM, high density memory, search acceleration, ECC architecture, automotive semiconductor, advanced node memory, 1.7GHz TCAM, cloud edge networking, content addressable memory, semiconductor research, high speed SoC memory

Diotec PW4512 1200V 45A Rectifier For Industrial Power

Diotec PW4512 standard recovery rectifier diode offers 1200V reverse voltage, 45A average forward current, 300A surge capability, and TO-247-2L packaging for industrial power supplies, inverters, and protection stages.

Diotec Semiconductor, PW4512, 1200V rectifier diode, 45A silicon diode, standard recovery rectifier, TO-247-2L diode, industrial power rectifier, surge current 300A, inverter diode, motor drive rectifier, UPS rectifier diode, battery charger diode, OR-ing diode, polarity protection diode, high voltage power semiconductor, line frequency rectifier

Navitas GeneSiC 5th Gen SiC MOSFET Improves Switching Loss

Navitas 5th generation GeneSiC 1200V SiC MOSFET platform improves RDS(on) × QGD figure of merit, soft body diode behavior, and reliability for AI data centers, grid infrastructure, and industrial power conversion.

Navitas Semiconductor, GeneSiC, 5th generation SiC, 1200V SiC MOSFET, trench assisted planar, TAP technology, silicon carbide MOSFET, RDS(on) QGD FoM, soft body diode, AI data center power, grid infrastructure converters, industrial electrification, SiC reliability, dynamic reverse bias testing, high voltage power semiconductors

Samtec’s 0.80 mm Edge-Card Sockets Target High-Speed Modular Designs

Samtec’s HSEC8 0.80 mm edge-card sockets use machined contacts to support high-speed, high-cycle modular systems.

Samtec, HSEC8, Generate series, edge card socket, 0.80 mm pitch, Edge Rate contact, high speed connector, signal integrity, modular systems, right angle connector, vertical connector, edge mount, power signal combo, PCB connector, datacom, telecom equipment, instrumentation, industrial electronics

Toshiba’s TB9104FTG Streamlines Control Of High Current Automotive Motors

Toshiba’s TB9104FTG gate driver uses SPI control to reduce wiring and MCU load in high current automotive motor systems.

Toshiba, TB9104FTG, gate driver, brushed DC motors, automotive motors, SPI control, PWM driver, body control modules, motor control, automotive electronics, AEC Q100, current sense amplifier, H bridge, dual half bridge, thermal management, MOSFET monitoring, automotive body systems

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