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Filtering by tag: "thermal management"

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SK hynix Brings New Heat Dissipation Technology to Mobile DRAM

SK hynix begins shipping mobile DRAM with High-K EMC, improving thermal conductivity 3.5× and reducing resistance to tackle AI smartphone heat issues.

sk hynix, dram, mobile memory, high-k emc, ai smartphones, heat dissipation, package on package, pop, memory packaging, thermal management, materials innovation

Nexperia Shrinks Power BJT Footprint with New CFP15B Packaging

Nexperia expands its BJT range with CFP15B-packaged MJPE devices, reducing footprint by 53% while maintaining thermal performance.

nexperia, bipolar transistors, discretes, power management, automotive, industrial, ev, display, bms, thermal management

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SK hynix Brings New Heat Dissipation Technology to Mobile DRAM

Nexperia Shrinks Power BJT Footprint with New CFP15B Packaging

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