News | The Component Club

AI Growth Exposes New Fault Lines Across the 2026 Component Supply Chain

ASC Global outlines how rising AI demand is reshaping component availability and creating new supply pressures across key categories in 2026.

ASC Global, supply chain, component availability, 2026 market trends, AI demand, passive components, discretes, logic devices, procurement strategy, traceability, regional manufacturing, qualification cycles, automotive electronics, industrial systems, semiconductor supply dynamics, market analysis, sourcing challenges

Alpha and Omega Semiconductor MOSFETs Target AI Server Power Density

Alpha and Omega Semiconductor has introduced the AONC40202 and AONC68816 MOSFETs in DFN 3.3 x 3.3 double-sided cooling source-down packages for AI server Intermediate Bus Converter applications.

Alpha and Omega Semiconductor, AOS, AONC40202, AONC68816, MOSFET, power MOSFET, AI servers, data centers, Intermediate Bus Converter, IBC, DC-DC conversion, source-down packaging, double-sided cooling, DFN 3.3x3.3, AlphaSGT, server power, thermal management, power density, PCB routing, silicon power devices

Navitas Pushes 800 VDC Directly to 6 V in AI Power

Navitas introduces an 800 VDC to 6 V power delivery board that removes the intermediate bus stage, enabling direct high-voltage to low-voltage conversion for AI data center power systems.

Navitas, NVIDIA, AI Data Centers, 800VDC, Power Conversion, GPU Power Delivery, HVDC, Data Center Power, DC-DC Converter, GaN Power, Power Architecture, AI Infrastructure, High Voltage, Server Design, Power Density

NXP and NVIDIA Target Real-Time Data Flow in Robots

NXP and NVIDIA introduce a robotics architecture using Holoscan Sensor Bridge to enable real-time data transport, sensor fusion, and synchronized motor control in humanoid and edge AI systems.

NXP, NVIDIA, Holoscan Sensor Bridge, robotics architecture, humanoid robots, edge AI, sensor fusion, real-time systems, time-sensitive networking, TSN, machine vision, motor control, embedded processors, distributed systems, robotics networking

Researchers Create Carbon Layer 0.8nm thick for future Hard Disk Drives

Despite the rise of SSDs, hard disk drives remain critical for large-scale and cost-effective data storage. This article explores HDD evolution, mechanical limitations, breakthroughs like the 0.8nm MAC protective layer, and why HDDs will continue to dominate archival, cloud, and high-density storage applications.

HDD technology, hard disk drives, 0.8nm MAC layer, high-density storage, future HDD research, National University of Singapore, data center storage, cloud storage, archival storage, HDD vs SSD, HAMR technology, magnetic recording, TMR read sensors, head-to-media spacing, enterprise storage solutions, RAID storage, long-term data storage, cost-effective storage, petabyte storage, storage infrastructure, large-scale storage systems

UltraRAM Technology Now Volume Scales, The Future of Memory

As UltraRAM moves into production, many are left wondering if it could become the future memory technology. What challenges does memory face, what is UltraRAM, and could it be the solution for the future?

ultraram, unified memory, dram, nand flash, non-volatile memory, gallium antimonide, aluminum antimonide, epitaxy, resonant tunneling, memory hierarchy, semiconductor memory, memory scalability, high-speed memory, long-term data retention, memory endurance, memory architecture, cpu cache, storage technology, next-generation memory, memory production, memory innovation

China To Introduce RISC-V Adoption Guidelines

As China continues to push its adoption of RISC-V, many wonder what this will mean for the famous processor architecture, and whether this decision could ripple through into Western markets. Why has RISC-V been so beneficial for China, what exactly has been said, and how could this decision change the processor landscape?

risc-v, china, open-source hardware, semiconductor policy, chip design, processor architecture, arm alternative, intel alternative, linux adoption, open computing, chinese technology strategy, ai chips, microcontrollers, global semiconductor market, open-source movement

Renesas Unveils Bidirectional 650 V GaN Switch For Simpler Power Stages

Renesas has launched the TP65B110HRU, a 650 V-class bidirectional GaN switch that blocks current in both directions in one device, helping simplify solar microinverters, AI data center power systems, and onboard EV chargers.

Renesas, TP65B110HRU, bidirectional GaN, GaN switch, 650 V GaN, SuperGaN, power conversion, solar microinverter, AI data center power, onboard EV charger, Vienna rectifier, depletion-mode GaN, standard gate driver, hard switching, soft switching, DC blocking, power semiconductor, TOLT package, high dvdt, switch count reduction

TE Connectivity MezzaWave Connectors Aim at Denser 56G Links

TE Connectivity has launched 56G MezzaWave connectors and cable assemblies for dense modular systems, supporting up to 56 Gbps PAM4 with open-pin-field architecture, routing flexibility, and standards-based interoperability.

TE Connectivity, MezzaWave, 56G connectors, 56 Gbps PAM4, cable assemblies, high-speed connectors, board-to-board connectors, open-pin-field array, edge AI, data centers, industrial automation, robotics, aerospace and defense, VITA 57.1, VITA 57.4, FMC, FMC+, ANSI, BGA, signal integrity, mezzanine connectors

Toshiba Photorelays Push Switching Reliability to 135°C

Toshiba introduces compact S-VSON4T photorelays rated for 135°C operation with integrated input resistors, designed for automated test equipment, probe cards, and burn-in systems.

Toshiba, photorelay, TLP3407SRB, TLP3412SRB, TLP3412SRHB, TLP3412SRLB, optoelectronic relay, solid state relay, automated test equipment, semiconductor tester, probe card switching, burn in systems, signal switching, high temperature electronics, S-VSON4T package

AI Growth Exposes New Fault Lines Across the 2026 Component Supply Chain

Alpha and Omega Semiconductor MOSFETs Target AI Server Power Density

Navitas Pushes 800 VDC Directly to 6 V in AI Power

NXP and NVIDIA Target Real-Time Data Flow in Robots

Researchers Create Carbon Layer 0.8nm thick for future Hard Disk Drives

UltraRAM Technology Now Volume Scales, The Future of Memory

China To Introduce RISC-V Adoption Guidelines

Renesas Unveils Bidirectional 650 V GaN Switch For Simpler Power Stages

TE Connectivity MezzaWave Connectors Aim at Denser 56G Links

Toshiba Photorelays Push Switching Reliability to 135°C

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