Latest News
The latest electronics news, featuring updates and announcements from leading companies in the electronic components industry. Stay informed on product releases, industry trends, and market insights.
Renesas Expands Magnet-Free Inductive Position Sensor Line for Automation and Robotics
Renesas’ new inductive position sensors provide accurate, magnet-free motion feedback for robotics and automation, supported by an online coil design tool.
Read MoreTI DLP Technology Pushes Maskless Lithography Toward Advanced Packaging
Texas Instruments’ DLP991UUV micromirror device delivers 8.9 MP resolution and sub-micron precision for advanced packaging and digital lithography.
Read MoreAdvanced Energy Expands Bus Converter Line with 1300 W and 1600 W Modules
Advanced Energy’s NDQ1300 and NDQ1600 deliver 48 V to 12 V conversion at 98% efficiency, built for AI servers, networking, and industrial systems.
Read MoreODU-MAC® Power Connector M216/M316 Adds Manual Option for High-Current Applications
ODU introduces M216/M316 manual power connectors with up to 600 A capability, IP2X protection, and modular Blue-Line compatibility for e-mobility and test systems.
Read MoreRohde & Schwarz Extends ZNB3000 Vector Network Analyzer Range to 54 GHz
The R&S ZNB3000 now covers up to 54 GHz, enabling PCIe 7.0, 50 GHz Ethernet, 6G, and SatCom testing with industry-leading speed and dynamic range.
Read MoreTDK-Lambda Adds 1200 W Models to CUS-M AC-DC Power Supply Series
TDK-Lambda’s CUS1200M brings 1200 W of medical- and industrial-rated AC-DC power in a compact 187 × 93 mm footprint with 30 dBA acoustic noise.
Read MoreVishay Launches First Automotive Y1-Rated Ceramic Capacitors in SMD Package
Vishay’s SMDY1 Automotive Series are the first Y1-rated ceramic capacitors in SMD format, combining 500 VAC rating, 4.7 nF capacitance, and Class IIB humidity grade for EV power systems.
Read MoreDeca and SST Partner to Advance NVM Chiplet Architectures
Deca and SST join forces to deliver modular NVM chiplets, combining Adaptive Patterning and SuperFlash technologies for advanced multi-die systems.
Read MoreCould Thousand Core RISC-V Devices Be The Key To Future Processors
Modern processors are reaching their limits not because of raw speed, but because of the growing gap between compute and memory. Could thousands of RISC-V cores sitting directly next to RAM be the way forward, and are we ready to abandon legacy architectures in favor of parallel-first designs?
Read MoreSynopsys Expands AI Capabilities For Chip Design Workflows
Synopsys has introduced new AI features across its EDA tools, from workflow assistants to automated verification and simulation with Ansys.
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