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TDK NTCSP Thermistors Push to 175 C Automotive Operation

TDK expands its NTCSP automotive NTC thermistor series to 175 C operation with AgPd terminations for conductive glue mounting, AEC Q200 qualification, and compact 1.6 x 0.8 mm packaging for power modules and high temperature sensing.

TDK, NTC thermistor, NTCSP series, automotive temperature sensor, AEC Q200, high temperature electronics, 175 C operation, conductive glue mounting, AgPd terminals, power semiconductor monitoring, EV power module, ABS electronics, transmission control, engine electronics, thermal compensation, B constant, 10k thermistor, 100k thermistor

ROHM SiC MOSFETs Power Toyota’s New bZ5 BEV in Chinese Market

ROHM’s SiC MOSFETs power Toyota’s new bZ5 BEV in China, boosting inverter efficiency and range through HAIMOSIC’s high-volume production.

ROHM, SiC MOSFET, traction inverter, Toyota bZ5, electric vehicle, BEV, HAIMOSIC, wide bandgap semiconductor, EV power module, Chinese EV market, FAW Toyota, BYD Toyota, automotive electronics, EV range, silicon carbide

TDK NTCSP Thermistors Push to 175 C Automotive Operation

ROHM SiC MOSFETs Power Toyota’s New bZ5 BEV in Chinese Market

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