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Microchip Optical Ethernet PHYs Combine Precise Timing and Built-In Security

Microchip introduces Optical Ethernet PHYs with sub-nanosecond synchronisation and MACsec encryption for deterministic, long-reach 10–25 Gbps networks.

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TI Unveils Power Solutions for Scalable AI Data Centres

Texas Instruments introduces new power management solutions and design resources to support scalable 800V AI data centre architectures.

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TI DLP Technology Pushes Maskless Lithography Toward Advanced Packaging

Texas Instruments’ DLP991UUV micromirror device delivers 8.9 MP resolution and sub-micron precision for advanced packaging and digital lithography.

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EPC Highlights GaN Power Advances at PCIM Asia 2025

EPC will showcase GaN solutions for AI servers, robotics, and UAVs at PCIM Asia 2025, as momentum grows for GaN to replace silicon in high-frequency power.

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Marvell Validates Structera CXL Across CPUs and Memory Suppliers

Marvell’s Structera CXL controllers are now validated across AMD, Intel, Micron, Samsung, and SK hynix, a milestone for AI and data-centre memory.

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Samsung Electro-Mechanics Introduces Ultra-High-Capacitance 0201 MLCC for AI Servers

Samsung Electro-Mechanics new 0201 MLCC offers 4.7 µF capacitance with X6S stability, optimised for AI server density and heat management.

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