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Toshiba 600 V Super Junction MOSFET Targets High-Density Power Systems

Toshiba’s TK057V60Z brings lower loss and a compact DFN8×8 package to 600 V power supplies used in data centres, UPS systems and solar equipment.

toshiba, tk057v60z, dtmosvi, super junction mosfet, 600 v mosfet, dfn8×8, kelvin source, power supplies, ups, data centre, photovoltaic, switching efficiency

Broadcom Launches Thor Ultra, the First 800G AI Ethernet NIC

Broadcom’s Thor Ultra brings 800G Ethernet to AI networking, combining UEC-compliant RDMA, PCIe Gen6, and open architecture for scalable data centres.

broadcom, thor ultra, 800g, ethernet, nic, rdma, uec, ai infrastructure, data centre, connectivity, pcie gen6, pam4, open ethernet

Marvell Introduces Linear Equalizers to Boost Copper Connectivity in AI Data Centres

Marvell’s new ACC linear equalizers extend copper reach for AI data centres, improving power efficiency and bandwidth up to 1.6T.

marvell, linear equalizer, active copper cable, acc, data centre, pam4, 800g, 1.6t, interconnect, ai infrastructure, server rack, aec, aoc

Navitas Expands GaN and SiC Power Devices for 800 V AI Data Centres

Navitas extends its GaNFast and GeneSiC semiconductor portfolio to support NVIDIA’s 800 V AI data-centre architecture with higher efficiency and density.

navitas semiconductor, ganfast, genesic, sic, gan, 800 v, ai data centre, power conversion, wide bandgap, gansafe, power chip, data centre, semiconductors, power management

Renesas Powers 800V Direct Current Architecture for AI Data Centres

Renesas’ GaN FETs and power semiconductors enable efficient 800V DC distribution in AI data centres, improving power density and reducing energy losses.

renesas electronics, gan fet, 800v dc, data centre, ai infrastructure, power conversion, wide bandgap, mosfet, llc dcx, energy efficiency, semiconductors

Microchip’s 3 nm PCIe Gen 6 Switch Targets AI Data Flow Bottlenecks

Microchip’s Switchtec Gen 6 PCIe switches improve bandwidth and latency in AI and HPC systems with 3 nm design, 160 lanes, and secure boot features.

microchip, switchtec gen 6, pcie 6.0, data centre, ai servers, interconnect, gpu, cpu, hpc, root of trust, cnsa 2.0, cloud infrastructure, semiconductors

Toshiba 650V SiC MOSFETs Boost Efficiency With Compact TOLL Package

Toshiba has launched 3rd generation 650V SiC MOSFETs in a compact TOLL package, cutting switching losses and improving power density for industrial and energy systems.

toshiba, sic, mosfet, wide bandgap, power electronics, toll package, data centre, ups, ev charging, pv inverter