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EPC9186HC2 and HC3 Bring GaN to 5 kW Motor Drives

EPC’s EPC9186HC2 and EPC9186HC3 evaluation boards use EPC2361 GaN FETs to support 3-phase BLDC motor drives up to 5 kW, targeting robotics, industrial automation, light EVs, forklifts, and drones.

EPC, EPC2361, EPC9186HC2, EPC9186HC3, GaN, eGaN, gallium nitride, motor drive, BLDC inverter, 3-phase inverter, robotics, industrial automation, light EV, electric scooter, forklift, agricultural machinery, drone power, field oriented control, motion control, power electronics

YAGEO SCF76X Chokes For High-Current Three-Phase EMI

YAGEO’s SCF76X three-phase common mode chokes bring nanocrystalline core technology, 65 A to 110 A current handling, low DCR, and industrial-grade thermal performance to modern inverter, HVAC, and power conversion designs.

YAGEO, KEMET, SCF76X, common mode choke, three-phase choke, EMI suppression, EMC, nanocrystalline core, power electronics, industrial inverter, HVAC, power conditioner, robotics, conducted EMI, high current choke, industrial power systems, passive components

EPC GaN Power Stages Push Motor Drives Toward Simpler Control

EPC’s new 100 V integrated GaN power stages combine FETs, gate drive, and protection in a compact package, giving motor drive, robotics, and power conversion designers tighter shutdown control, 100% duty-cycle support, and simpler system integration.

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congatec Extends Core Ultra COMs for Rugged Edge AI

congatec has expanded its Intel Core Ultra Series 3 COM family with rugged -40 °C to +85 °C variants for embedded edge AI and industrial systems.

congatec, Intel Core Ultra Series 3, computer-on-module, COM, COM-HPC, COM Express, edge AI, embedded computing, rugged computing, industrial computing, industrial temperature, robotics, automation, transportation, energy infrastructure, smart city, railway systems

EPC GaN Inverter Board Targets Faster BLDC Prototyping

EPC’s EPC91121 gives engineers a compact three-phase GaN inverter platform for 24 V-class BLDC development, combining 50 ARMS output, integrated sensing, controller support, and switching up to 150 kHz.

EPC, EPC91121, EPC2366, GaN, eGaN, BLDC motor drive, three-phase inverter, motor control, power electronics, field-oriented control, space-vector PWM, 24 V motor drive, robotics, drones, industrial automation, handheld power tools, evaluation board, power transistor

TE Connectivity MezzaWave Connectors Aim at Denser 56G Links

TE Connectivity has launched 56G MezzaWave connectors and cable assemblies for dense modular systems, supporting up to 56 Gbps PAM4 with open-pin-field architecture, routing flexibility, and standards-based interoperability.

TE Connectivity, MezzaWave, 56G connectors, 56 Gbps PAM4, cable assemblies, high-speed connectors, board-to-board connectors, open-pin-field array, edge AI, data centers, industrial automation, robotics, aerospace and defense, VITA 57.1, VITA 57.4, FMC, FMC+, ANSI, BGA, signal integrity, mezzanine connectors

South Korea Pushes For National Semiconductor Power Sovereignty

South Korea has launched a national task force led by Koo Sang-mo to achieve power semiconductor self-reliance by 2030, focusing on silicon carbide (SiC) and gallium nitride (GaN) technologies for EVs, power grids, AI data centers, defense, and robotics.

South Korea, power semiconductors, Koo Sang-mo, silicon carbide, SiC, gallium nitride, GaN, EVs, AI data centers, power grids, defense technology, robotics, semiconductor sovereignty, national infrastructure, energy security

Kontron mITX Board With Ryzen AI Embedded P100 Targets Real-Time Edge AI

Kontron’s K4131 Px mITX motherboard uses the AMD Ryzen AI Embedded P100 to combine multi display graphics, local AI inference, legacy connectivity and wide input power handling for industrial edge automation, vision and HMI systems.

Kontron, AMD, Ryzen AI Embedded P100, K4131 Px, mITX motherboard, edge AI, machine vision, HMI systems, embedded computing, DisplayPort, LVDS, eDP, M.2 expansion, industrial automation, robotics, AMR, multi display, serial interfaces, COM ports, wide input power, embedded systems, industrial edge computing

Melexis MLX90520 Brings 22 Bit Inductive Precision to Large Mechanisms

The Melexis MLX90520 delivers 22 bit inductive position sensing for large rotary and linear motion systems with a thin, dust resistant design.

Melexis, MLX90520, inductive encoder, position sensor, 22 bit resolution, rotary sensing, linear sensing, SIL 3, robotics, machinery, industrial automation, motion control, position feedback, encoder IC, through shaft encoder, SPI, SSI, sensor integration, dust resistant sensing, semiconductor

Microchip Extends PolarFire Video Platform for High Bandwidth Embedded Imaging

Microchip adds SDI IP cores and a quad CoaXPress bridge to its PolarFire FPGA video platform for high bandwidth embedded imaging.

Microchip, PolarFire, FPGA, SDI, CoaXPress, CXP, SLVS EC, embedded vision, video transport, medical imaging, industrial imaging, robotics, low power FPGA, SmartHLS, Libero, SMPTE, high bandwidth video, hardware security

EPC9186HC2 and HC3 Bring GaN to 5 kW Motor Drives

YAGEO SCF76X Chokes For High-Current Three-Phase EMI

EPC GaN Power Stages Push Motor Drives Toward Simpler Control

congatec Extends Core Ultra COMs for Rugged Edge AI

EPC GaN Inverter Board Targets Faster BLDC Prototyping

TE Connectivity MezzaWave Connectors Aim at Denser 56G Links

South Korea Pushes For National Semiconductor Power Sovereignty

Kontron mITX Board With Ryzen AI Embedded P100 Targets Real-Time Edge AI

Melexis MLX90520 Brings 22 Bit Inductive Precision to Large Mechanisms

Microchip Extends PolarFire Video Platform for High Bandwidth Embedded Imaging

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