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Apple Cuts iPhone 17 Production Due to DRAM Shortage

As the DRAM crises continues, Apple has now announced that it is cutting back manufacturing of its iPhone 17 due to memory shortages. What exactly has Apple said, and why does this shortage support an argument for government intervention over the AI industry?

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Rambus Introduces DDR5 Server RDIMM To Tackel AI Needs

As the memory needs for AI continue to increase, engineers are finding it hard to address the latest AI challenges. Now, Rambus has announced its latest DDR5 RDIMM memory that it says could help with an agentic future.

Rambus DDR5 RDIMM, DDR5-9600 server memory, AI data center memory, high bandwidth memory, agentic AI workloads, HPC server memory, RCD06 Registering Clock Driver, PMIC5030, server memory bandwidth, power efficient memory, memory supply challenges, RDIMM chipset, memory prices, AI infrastructure memory, memory manufacturers

SK hynix Targets HBM Thermal Bottlenecks With Integrated Cooling Structure

SK hynix has introduced its iHBM thermal solution for next-generation HBM memory, embedding integrated cooling elements directly into the package to reduce thermal resistance by 30 percent in AI accelerator systems.

SK hynix, iHBM, HBM, HBM5, AI memory, high bandwidth memory, thermal management, AI accelerator, GPU memory, HPC, data center, semiconductor packaging, MR-MUF, wafer level packaging, memory cooling, D2D PHY, AI infrastructure, advanced packaging, memory technology

Samsung HBM4 Ships At 11.7Gbps And 3.3TB/s Per Stack

Samsung begins mass production of HBM4 delivering 11.7Gbps per pin and up to 3.3TB/s per stack with 4nm logic base die, 2,048 I/Os, and improved power efficiency for AI datacenters.

Samsung Electronics, HBM4, high bandwidth memory, 11.7Gbps, 13Gbps headroom, 3.3TB per second, 4nm logic base die, 1c DRAM process, 12-layer stacking, 16-layer HBM, AI datacenter memory, GPU memory bandwidth, TSV technology, power distribution network optimization, HBM3E comparison, hyperscale computing

Why SK hynix LPDDR5X Achieving ASIL D Matters for Automotive Memory

SK hynix LPDDR5X automotive DRAM achieves ASIL D, strengthening data reliability for ADAS and SDV platforms.

SK hynix, LPDDR5X, automotive DRAM, ASIL D, ISO 26262, functional safety, ADAS, autonomous driving, SDV, memory reliability, ECC, TÜV SÜD, SPFM, LFM, PMHF, high bandwidth memory, automotive electronics, data integrity

AMD MI300X Enables Large-Scale MoE Training for Zyphra

Zyphra trains its ZAYA1 MoE model on AMD MI300X GPUs without sharding, using 192 GB memory and faster I O to simplify large scale AI training.

amd, zyphra, mi300x, zaya1, moe model, high bandwidth memory, ai training, gpu architecture, rocm, pensando networking, ibm cloud

SK hynix Completes HBM4 Development and Prepares for Mass Production

SK hynix has completed HBM4 development, doubling bandwidth and improving power efficiency by 40% to support growing AI workloads.

sk hynix, hbm4, high bandwidth memory, ai infrastructure, data center, mr-muf, dram, memory packaging, 2, 048 i/o, semiconductor manufacturing