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SK hynix Targets HBM Thermal Bottlenecks With Integrated Cooling Structure

SK hynix has introduced its iHBM thermal solution for next-generation HBM memory, embedding integrated cooling elements directly into the package to reduce thermal resistance by 30 percent in AI accelerator systems.

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Diodes Introduces PCIe 7.0 Clock Generator For 128GT/s Links

Diodes Incorporated has introduced the PI6CG33A06 PCIe 7.0 clock generator with sub-30fs RMS jitter, six differential outputs, and LP-HCSL outputs for servers, HPC systems, and AI infrastructure.

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Broadcom Ships Tomahawk Ultra: A New Benchmark for Ethernet in AI and HPC

Broadcom's Tomahawk Ultra delivers 250ns latency, lossless Ethernet, and in-network collectives for scale-up AI and HPC systems.

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Inside Intel’s Aurora: Engineering the Exascale Era

Intel’s Aurora Supercomputer at Argonne delivers exaflop performance, enabling breakthroughs in AI, physics, and scientific computing.

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