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Filtering by tag: "HBM"
Clear tag filterSK hynix Targets HBM Thermal Bottlenecks With Integrated Cooling Structure
SK hynix has introduced its iHBM thermal solution for next-generation HBM memory, embedding integrated cooling elements directly into the package to reduce thermal resistance by 30 percent in AI accelerator systems.
Read MoreThe AI Tax: Why Your Next Computer and Car Are Becoming Collateral Damage in the Silicon Supercycle
ASC Global outlines how AI demand is reshaping memory supply, raising costs, and pushing PCs, automotive, and industrial systems into tighter component constraints.
Read MoreChinese Researchers Create New 3D DRAM Technology
DRAM underpins modern computing, but traditional planar designs are struggling to scale as memory demands rise. Researchers at IME CAS have unveiled a novel 3D DRAM architecture using a dual-gate 4F2 2T0C cell, enabling higher density, multi-level storage, and improved performance, potentially paving the way for dramatically larger RAM capacities.
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