Infineon Brings Solid-State Isolation to PVI Footprints with ISSI20BxxF Family

Uploaded image Infineon Technologies has introduced the ISSI20BxxF Solid State Isolator (SSI) family, bringing solid-state isolation technology to applications traditionally served by photovoltaic isolators (PVIs), photovoltaic relays (PVRs), and electromechanical relays (EMRs).

The new family is housed in a PG-DSO-8 150 mil package with a footprint comparable to existing PVI devices, giving designers a straightforward upgrade path to SSI technology in space-constrained designs. By combining higher output-drive capability, integrated protection features, and support for a wide range of external power switches, the devices target high-volume industrial applications including PLC I/O modules, solid-state relays, laboratory power supplies, automated test equipment, building automation, and telecom infrastructure.

Drop-In Upgrade for Existing PVI Designs

One of the key advantages of the ISSI20BxxF family is its compatibility with layouts already designed around photovoltaic isolators. While maintaining a similar PCB footprint, the new devices replace the photovoltaic output stage with Infineon's proprietary coreless-transformer isolation technology. This transfers both signal and energy across the isolation barrier, allowing the device to drive external power switches without requiring a dedicated isolated gate supply.

The higher output-drive capability also enables compatibility with a broader selection of external MOSFETs and other power switches than conventional PVI-based solutions.

Integrated Protection Reduces External Circuitry

The ISSI20BxxF family integrates several protection functions that would otherwise require additional external components. These include over-current protection, over-temperature protection, fast fault turn-off, and latch-off capability, helping improve system robustness while reducing circuit complexity. Selected variants also include dynamic Miller clamp and fast turn-on functionality for applications with more demanding switching requirements. Compared with electromechanical relays, SSI-based solid-state relays also eliminate mechanical wear, contact bounce, and electrical arcing, supporting silent operation and longer service life in high-cycle applications.

Three Devices with 3 kVrms Isolation

The family consists of the ISSI20B02F, ISSI20B03F, and ISSI20B11F, all housed in the compact PG-DSO-8 150 mil package.

Each device provides 3 kVrms isolation, 4 mm creepage distance, and UL 1577 certification, making the family suitable for applications requiring basic isolation under applicable safety standards.

The new devices complement Infineon's previously introduced ISSI20RxxH and ISSI30RxxH families, extending the company's SSI portfolio to designs where board space is more limited.

Availability

The Infineon ISSI20B02F, ISSI20B03F, and ISSI20B11F are available now.

Evaluation hardware, application notes, technical training, and additional design resources are also available.

Learn more and read the original announcement at the Infineon website.

Technology Overview

Solid State Isolators transfer signals across an isolation barrier without using mechanical contacts or optical coupling. In power-switching applications, they can drive external MOSFETs or other semiconductor switches while maintaining galvanic isolation, providing an alternative to photovoltaic isolators and electromechanical relays in compact, high-cycle designs.

Frequently Asked Questions

What is new about the ISSI20BxxF family?

The ISSI20BxxF family brings Infineon's Solid State Isolator technology into a compact PG-DSO-8 150 mil package with a footprint comparable to existing photovoltaic isolator solutions, providing an easier upgrade path for existing designs.

Does the ISSI20BxxF require an isolated gate supply?

No. Infineon's coreless-transformer technology transfers both signal and energy across the isolation barrier, allowing the device to drive external power switches without a dedicated isolated gate supply.

Which protection features are integrated?

Depending on the device, the family includes over-current protection, over-temperature protection, fast fault turn-off, latch-off capability, and support for dynamic Miller clamp and fast turn-on.