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ROHM 5th Gen SiC MOSFETs Reduce High-Temp Losses

ROHM has introduced 5th Generation EcoSiC MOSFETs for EV and industrial power systems, claiming about 30% lower ON resistance at 175°C than its 4th Generation devices, with discrete and module samples scheduled from July 2026.

ROHM, EcoSiC, SiC MOSFET, silicon carbide, power semiconductor, EV traction inverter, onboard charger, OBC, DC-DC converter, AI server power supply, data center power, PV inverter, ESS, UPS, eVTOL, AC servo, automotive power electronics, industrial power conversion, high temperature MOSFET, wide bandgap

MaxLinear Pushes RS-485 Speed Higher Without Losing Industrial Margin

MaxLinear’s MxL8323x RS-485 and RS-422 transceivers bring data rates from 500 kbps to 50 Mbps, wide logic compatibility, strong EFT and ESD protection, and support for up to 256 nodes in harsh industrial networks.

MaxLinear, MxL8323x, MxL83232, MxL83233, MxL83234, MxL83235, MxL83236, RS-485, RS-422, industrial transceiver, half-duplex transceiver, industrial networking, motor drive, HVAC control, factory automation, smart grid, building security, EFT protection, ESD protection, serial interface

Emerson Extends NI PXI Platform With Lower Cost Hardware for Scalable Automated Test

Emerson adds cost effective NI PXI oscilloscopes, DAQs and controllers to help engineers build scalable automated test systems.

Emerson, NI, PXI, PXIe, automated test, mixed signal test, oscilloscopes, DAQ modules, embedded controllers, PXIe 5108, PXIe 1081, PXIe 6381, PXIe 6383, test automation, LabVIEW, TestStand, InstrumentStudio, modular test systems, high resolution measurements, synchronized measurements

Broadcom Ships Tomahawk Ultra: A New Benchmark for Ethernet in AI and HPC

Broadcom's Tomahawk Ultra delivers 250ns latency, lossless Ethernet, and in-network collectives for scale-up AI and HPC systems.

Broadcom, Tomahawk Ultra, Ethernet Switch, AI Infrastructure, HPC, Low Latency, Lossless Networking, In Network Compute, Data Center, SUE, SUE Lite, Link Layer Retry, Edge AI, Semiconductor, Networking Hardware, High Performance Computing

Kyocera Clock Oscillators Cut Jitter In AI Server Links

Kyocera’s X Series differential clock crystal oscillators target AI servers and other high-speed systems with typical phase jitter as low as 30 fs, LV-PECL and LVDS outputs, compact packages, and reduced power consumption.

Kyocera, X Series, differential clock oscillator, crystal oscillator, low phase jitter, 30 fs jitter, AI server, optical transceiver, storage application, ADAS, LVDS, LV-PECL, timing device, high-speed communication, network equipment, 156.25 MHz, 312.5 MHz, low noise oscillator, femtoseconds, reference clock

Researchers Create Carbon Layer 0.8nm thick for future Hard Disk Drives

Despite the rise of SSDs, hard disk drives remain critical for large-scale and cost-effective data storage. This article explores HDD evolution, mechanical limitations, breakthroughs like the 0.8nm MAC protective layer, and why HDDs will continue to dominate archival, cloud, and high-density storage applications.

HDD technology, hard disk drives, 0.8nm MAC layer, high-density storage, future HDD research, National University of Singapore, data center storage, cloud storage, archival storage, HDD vs SSD, HAMR technology, magnetic recording, TMR read sensors, head-to-media spacing, enterprise storage solutions, RAID storage, long-term data storage, cost-effective storage, petabyte storage, storage infrastructure, large-scale storage systems

AI Growth Exposes New Fault Lines Across the 2026 Component Supply Chain

ASC Global outlines how rising AI demand is reshaping component availability and creating new supply pressures across key categories in 2026.

ASC Global, supply chain, component availability, 2026 market trends, AI demand, passive components, discretes, logic devices, procurement strategy, traceability, regional manufacturing, qualification cycles, automotive electronics, industrial systems, semiconductor supply dynamics, market analysis, sourcing challenges

AOS Backs NVIDIA’s 800 VDC Power Architecture With SiC and GaN for Next-Generation AI Factories

AOS introduces SiC, GaN and MOSFET solutions to support NVIDIA’s 800 VDC architecture for high-efficiency AI data centers, from AC-to-DC conversion to rack-level power stages.

aos, alpha and omega semiconductor, 800 vdc, nvidia, ai factory, sic, gan, mosfet, power conversion, data center power, high voltage, ac to dc, dc to dc, ai infrastructure, wide bandgap devices

UltraRAM Technology Now Volume Scales, The Future of Memory

As UltraRAM moves into production, many are left wondering if it could become the future memory technology. What challenges does memory face, what is UltraRAM, and could it be the solution for the future?

ultraram, unified memory, dram, nand flash, non-volatile memory, gallium antimonide, aluminum antimonide, epitaxy, resonant tunneling, memory hierarchy, semiconductor memory, memory scalability, high-speed memory, long-term data retention, memory endurance, memory architecture, cpu cache, storage technology, next-generation memory, memory production, memory innovation

Researchers Create Multi-Function Transistor That Could Shrink Designs By 75%

In a world where reducing transistor sizes is beginning to have less of an effect on device density, researchers are trying to find new ways of packing more transistors on chips. Now, researchers claim to have created a new multi-function transistor that can shrink down designs as much as 75%.

multi-function transistor, semiconductor device, transistor shrinking, device miniaturization, negative differential transconductance, D-NDT, ZnO-Te heterojunction, frequency quadrupler, low-temperature BEOL, 3D integrated circuits, high-density electronics, AI hardware semiconductors, advanced chip integration, transistor count reduction, future semiconductor technology

ROHM 5th Gen SiC MOSFETs Reduce High-Temp Losses

MaxLinear Pushes RS-485 Speed Higher Without Losing Industrial Margin

Emerson Extends NI PXI Platform With Lower Cost Hardware for Scalable Automated Test

Broadcom Ships Tomahawk Ultra: A New Benchmark for Ethernet in AI and HPC

Kyocera Clock Oscillators Cut Jitter In AI Server Links

Researchers Create Carbon Layer 0.8nm thick for future Hard Disk Drives

AI Growth Exposes New Fault Lines Across the 2026 Component Supply Chain

AOS Backs NVIDIA’s 800 VDC Power Architecture With SiC and GaN for Next-Generation AI Factories

UltraRAM Technology Now Volume Scales, The Future of Memory

Researchers Create Multi-Function Transistor That Could Shrink Designs By 75%

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