Latest News

The latest electronics news, featuring updates and announcements from leading companies in the electronic components industry. Stay informed on product releases, industry trends, and market insights.


Search results for: "RS"

Found 690 result(s)

Clear search

ROHM 100 V MOSFET Supports 48 V AI Server Hot-Swap in 5×6 mm Package

ROHM’s RS7P200BM provides wide SOA and low RDSon in a compact 5×6 mm package for 48 V AI server and industrial power protection.

Read More

ABLIC S-19560B PMIC Reduces Camera Module Power Footprint

ABLIC’s S-19560B PMIC integrates three power rails in a compact package to shrink automotive camera modules and improve thermal efficiency.

Read More

RECOM Launches DIN Rail Redundancy Module for High-Reliability Power Systems

RECOM’s RD40 redundancy module enables efficient high current DIN rail power systems with MOSFET gating and minimal voltage drop.

Read More

SemiQ Expands 1200 V Gen3 SiC MOSFET Line with New SOT-227 Modules

SemiQ has released new 1200 V Gen3 SiC MOSFET SOT-227 modules with 7.4, 14.5 and 34 mΩ options for chargers, solar inverters and high-power systems.

Read More

Toshiba Expands DTMOSVI 600 V MOSFET Series with Four-Pin Package for Higher Efficiency

Toshiba’s new DTMOSVI 600 V MOSFETs in the TO-247-4L(X) package reduce switching loss and improve efficiency for servers, UPS and PV inverters.

Read More

Nisshinbo Micro Devices Launches Quad-Channel PMIC to Simplify Automotive Camera Designs

Nisshinbo Micro Devices introduces the NP8700, a four-channel power management IC that integrates buck and LDO regulators to shrink automotive camera designs and reduce EMI.

Read More

Kyocera AVX Expands MLCC Range with KGP Series for High-Frequency Designs

Kyocera AVX’s KGP Series stacked MLCCs deliver higher capacitance, low ESR/ESL, and strong reliability for industrial and high-frequency designs.

Read More

TI Unveils Power Solutions for Scalable AI Data Centres

Texas Instruments introduces new power management solutions and design resources to support scalable 800V AI data centre architectures.

Read More

Infineon Introduces 48 V to 800 V Power Path Protection for AI Data Centres

Infineon’s new smart eFuses and 400 V / 800 V hot-swap reference design improve power protection and reliability in AI data-centre architectures.

Read More

TI DLP Technology Pushes Maskless Lithography Toward Advanced Packaging

Texas Instruments’ DLP991UUV micromirror device delivers 8.9 MP resolution and sub-micron precision for advanced packaging and digital lithography.

Read More
1 43 44 45 46 47 69