Latest News
The latest electronics news, featuring updates and announcements from leading companies in the electronic components industry. Stay informed on product releases, industry trends, and market insights.
ROHM 100 V MOSFET Supports 48 V AI Server Hot-Swap in 5×6 mm Package
ROHM’s RS7P200BM provides wide SOA and low RDSon in a compact 5×6 mm package for 48 V AI server and industrial power protection.
Read MoreABLIC S-19560B PMIC Reduces Camera Module Power Footprint
ABLIC’s S-19560B PMIC integrates three power rails in a compact package to shrink automotive camera modules and improve thermal efficiency.
Read MoreRECOM Launches DIN Rail Redundancy Module for High-Reliability Power Systems
RECOM’s RD40 redundancy module enables efficient high current DIN rail power systems with MOSFET gating and minimal voltage drop.
Read MoreSemiQ Expands 1200 V Gen3 SiC MOSFET Line with New SOT-227 Modules
SemiQ has released new 1200 V Gen3 SiC MOSFET SOT-227 modules with 7.4, 14.5 and 34 mΩ options for chargers, solar inverters and high-power systems.
Read MoreToshiba Expands DTMOSVI 600 V MOSFET Series with Four-Pin Package for Higher Efficiency
Toshiba’s new DTMOSVI 600 V MOSFETs in the TO-247-4L(X) package reduce switching loss and improve efficiency for servers, UPS and PV inverters.
Read MoreNisshinbo Micro Devices Launches Quad-Channel PMIC to Simplify Automotive Camera Designs
Nisshinbo Micro Devices introduces the NP8700, a four-channel power management IC that integrates buck and LDO regulators to shrink automotive camera designs and reduce EMI.
Read MoreKyocera AVX Expands MLCC Range with KGP Series for High-Frequency Designs
Kyocera AVX’s KGP Series stacked MLCCs deliver higher capacitance, low ESR/ESL, and strong reliability for industrial and high-frequency designs.
Read MoreTI Unveils Power Solutions for Scalable AI Data Centres
Texas Instruments introduces new power management solutions and design resources to support scalable 800V AI data centre architectures.
Read MoreInfineon Introduces 48 V to 800 V Power Path Protection for AI Data Centres
Infineon’s new smart eFuses and 400 V / 800 V hot-swap reference design improve power protection and reliability in AI data-centre architectures.
Read MoreTI DLP Technology Pushes Maskless Lithography Toward Advanced Packaging
Texas Instruments’ DLP991UUV micromirror device delivers 8.9 MP resolution and sub-micron precision for advanced packaging and digital lithography.
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